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LS1026AXE8MQA

NXP Semiconductors

LS1026AXE8MQA by NXP Semiconductors

LS1026AXE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width and 14-bit address bus width. It features a grid array, fine pitch package style and is compatible with I2C, PCI, SPI, UART, and USB buses. This component is suitable for applications requiring high-speed data processing in compact electronic devices.

Median Price

$86.506

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 77 parts In-Stock

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Flip Electronics (Authorized)

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Verical

USA . 40 parts In-Stock

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Vyrian

USA . 4,151 parts In-Stock

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Digiode

USA . 2,303 parts In-Stock

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Anansix

USA . 1,696 parts In-Stock

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Flip Electronics

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Nova Conductors

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Distributors (Availability)

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AZTECH Wire

Italy . 639 parts In-Stock

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$10.399

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Aztec Data Supply Inc.

USA . 3,462 parts In-Stock

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$22.512

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Ampacity Inc.

Singapore . 77 parts In-Stock

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$35.000

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Corohmni

South Africa . 56 parts In-Stock

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Microchip USA

USA . 2,962 parts In-Stock

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Vigor

Singapore . 2,885 parts In-Stock

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Corphita

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Argo Parts USA

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Aranea Global

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UNI Independent Distributors

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Continental Prestige Electronics

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Overview

Elevate your electronic designs with the LS1026AXE8MQA by NXP Semiconductors, a leading manufacturer in the industry. This multi-functional peripheral offers a wide range of applications and benefits for customers seeking high-quality components. With advanced technology and a reliable design, this product provides value through its versatility and efficiency. Upgrade your projects with the LS1026AXE8MQA and experience the advantages of superior performance and seamless integration.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable multi-functional peripherals.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 0.93 V

Efficient power usage with a maximum supply voltage of 0.93 V.

Address Bus Width: 14

Wide address bus width of 14 enables efficient data transfer and communication.

Package Shape: SQUARE

Square shape helps in efficient utilization of space and easy placement within compact devices.

No. of Terminals: 780

High number of terminals ensure connectivity options for various functionalities and interfaces.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design allows for high-density packaging and saves space on the circuit board.

Minimum Supply Voltage: 0.87 V

Stable operation even at low minimum supply voltage of 0.87 V.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Terminal finish with tin/silver/copper ensures good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position facilitates better heat dissipation and efficient circuit design.

Maximum Seated Height: 2.61 mm

Low seated height of 2.61 mm allows for slim profile and compact design of the multi-functional peripherals.

Width: 23 mm

Compact width of 23 mm enables versatile placement options in various devices.

Boundary Scan: YES

Boundary Scan feature aids in testing and debugging the peripheral for enhanced reliability.

External Data Bus Width: 64

Wide external data bus width of 64 ensures fast data transfer speeds and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the product can withstand reflow soldering processes effectively.

Peak Reflow Temperature °C: 250

Peak reflow temperature of 250°C ensures proper soldering and integration with other components during manufacturing.

Length: 23 mm

Compact length of 23 mm offers flexibility in design and placement options for the multi-functional peripherals.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable performance for the multi-functional peripherals.

Terminal Form: BALL

Ball terminal form provides secure connections and ease of installation on the circuit board.

Nominal Supply Voltage: 0.9 V

Nominal supply voltage of 0.9 V ensures stable and optimal performance of the multi-functional peripherals.

Bus Compatibility: I2C, PCI, SPI, UART, USB

Compatible with a wide range of bus interfaces like I2C, PCI, SPI, UART, and USB for versatile connectivity options.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8 mm allows for high-density packaging and efficient circuit design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 ensures proper handling and storage of the multi-functional peripherals to prevent damage.

No. of I/O Lines: 76

Abundance of I/O lines (76) offers versatility in connecting to various peripherals and devices for enhanced functionality.

Technical Specifications

Multi-functional Peripherals LS1026AXE8MQA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, PCI, SPI, UART, USB

External Data Bus Width:

64

JESD-30 Code:

S-PBGA-B780

JESD-609 Code:

e1

Length:

23 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

76

No. of Terminals:

780

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

.93 V

Minimum Supply Voltage:

.87 V

Nominal Supply Voltage:

.9 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Trade Compliance

LS1026AXE8MQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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