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STPCE1EEBC

STMicroelectronics

STPCE1EEBC by STMicroelectronics

STPCE1EEBC by STMicroelectronics is a multifunctional peripheral IC with a 32-bit address bus and operates at supply voltages of 2.5V to 3.3V. It features a max clock frequency of 14.318 MHz and supports PCI/ISA bus compatibility. Ideal for commercial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,599

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-

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Anansix

USA . 2,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,081

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Vyrian

USA . 2,004 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,004

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,252 parts In-Stock

1+ parts

$37.669

100+ parts

-

1k+ parts

$33.902

10k+ parts

-

2,252

$37.669

-

$33.902

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MKK Technologies

India . 56 parts In-Stock

1+ parts

$70.835

100+ parts

-

1k+ parts

-

10k+ parts

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56

$70.835

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-

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DigiPath Technology Company

USA . 56 parts In-Stock

1+ parts

$70.835

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$70.835

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-

-

Corohmni

South Africa . 3,062 parts In-Stock

1+ parts

$83.229

100+ parts

-

1k+ parts

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10k+ parts

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3,062

$83.229

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Corphita

USA . 1,407 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,407

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Parana Technologies

USA . 1,035 parts In-Stock

1+ parts

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100+ parts

$45.040

1k+ parts

-

10k+ parts

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1,035

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$45.040

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Overview

Unlock limitless possibilities with the STPCE1EEBC from STMicroelectronics—a premier choice in multi-functional peripherals. Renowned for their innovation and reliability, STMicroelectronics delivers unmatched quality that empowers your designs with superior performance. This versatile component seamlessly integrates into various applications, offering robust functionality and efficiency. Elevate your projects' capabilities while enjoying the peace of mind that comes with trusted engineering excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy for the package body ensures durability and protection against environmental factors, making the product reliable in various settings.

Surface Mount: YES

Surface mount technology enables compact designs and efficient use of board space, making it ideal for modern electronics where space is a premium.

Maximum Supply Voltage: 2.7 V

A maximum supply voltage of 2.7 V ensures compatibility with a wide range of low-voltage applications, enhancing its performance in power-sensitive environments.

Address Bus Width: 32

The 32-bit address bus width allows for the addressing of a larger memory space, which is beneficial for applications requiring extensive data handling.

Package Shape: SQUARE

The square package shape facilitates dense circuit layouts and efficient thermal performance, making it better suited for high-density applications.

Bit Size: 32

A 32-bit architecture supports high data throughput and faster processing, making it suitable for demanding computing tasks.

Power Supplies (V): 2.5, 3.3

Supports multiple power supply voltages (2.5V and 3.3V), providing flexibility for integration in various systems and reducing the need for additional voltage regulators.

No. of Terminals: 388

A high number of terminals (388) offers extensive connectivity options for peripheral devices, enhancing system functionality.

Package Style (Meter): GRID ARRAY

Grid array packaging optimizes performance and electrical characteristics, enabling better signal integrity in high-speed applications.

Minimum Supply Voltage: 2.45 V

The low minimum supply voltage of 2.45 V allows the product to operate efficiently in battery-powered or power-sensitive applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in a variety of environments, including industrial applications.

Minimum Operating Temperature: 0 °C

Operational capability from 0 °C allows this product to function effectively in a wide range of climates.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and ensures long-term reliability in electronic connections.

Terminal Position: BOTTOM

Bottom terminal positioning enables efficient heat dissipation and simplified PCB design, making installation easier.

Maximum Seated Height: 2.38 mm

With a low seated height of just 2.38 mm, this component contributes to a slim profile for space-constrained applications.

Width: 35 mm

The compact width of 35 mm is suitable for various applications, allowing for versatile usage in different devices.

Boundary Scan: YES

The inclusion of boundary scan improves testability and diagnostics of the circuitry, increasing the reliability of the final product.

External Data Bus Width: 32

A 32-bit external data bus width enhances the speed and efficiency of data transfers to and from memory, suitable for high-performance applications.

Maximum Clock Frequency: 14.318 MHz

A maximum clock frequency of 14.318 MHz supports efficient processing speeds, facilitating quicker data handling.

Length: 35 mm

The length of 35 mm allows for harmonious integration into various system designs, accommodating different layout requirements.

Temperature Grade: COMMERCIAL EXTENDED

The extended commercial temperature grade ensures reliable performance in environments that experience a wider range of operating temperatures.

Peripheral IC Type: MULTIFUNCTION PERIPHERAL

As a multifunction peripheral IC, it supports multiple functions in a single chip, reducing component count and simplifying circuit design.

Technology: CMOS

CMOS technology ensures low power consumption while offering high performance, making it ideal for battery-operated devices.

Terminal Form: BALL

Ball terminal form provides reliable connections and simplifies soldering processes, improving manufacturing efficiency.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V strikes a balance between performance and power efficiency, making it versatile for various designs.

Bus Compatibility: PCI; ISA

Compatibility with both PCI and ISA buses allows for broader integration into existing systems, enhancing flexibility and usability.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm accommodates modern PCB designs and offers greater layout flexibility in compact applications.

Speed: 100 rpm

A speed rating of 100 rpm is indicative of efficiency in operational dynamics, making it suitable for numerous applications requiring rapid responses.

No. of I/O Lines: 16

With 16 I/O lines, this product provides substantial interfacing capacity with peripherals, enhancing overall system interaction.

Technical Specifications

Multi-functional Peripherals STPCE1EEBC attributes and parameters. Explore more Multi-functional Peripherals devices from STMicroelectronics

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Bus Compatibility:

PCI; ISA

Maximum Clock Frequency:

14.318 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B388

JESD-609 Code:

e0

Length:

35 mm

No. of I/O Lines:

16

No. of Terminals:

388

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA388,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.38 mm

Speed:

100 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.45 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

35 mm

Peripheral IC Type:

Trade Compliance

STPCE1EEBC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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