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66AK2H06DAAWA24

Texas Instruments

66AK2H06DAAWA24 by Texas Instruments

The Texas Instruments 66AK2H06DAAWA24 is a multi-functional peripheral with an address bus width of 32 bits and external data bus width of 128 bits. It operates in industrial temperature grades, featuring a CMOS technology microprocessor suitable for applications requiring Ethernet, I2C, PCI, SPI, UART, and USB bus compatibility. With a package style of grid array and terminal pitch of 1mm, it offers high performance in compact dimensions.

Median Price

$607.098

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 88 parts In-Stock

1+ parts

$607.098

100+ parts

$549.528

1k+ parts

$523.360

10k+ parts

-

88

$607.098

$549.528

$523.360

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,366 parts In-Stock

1+ parts

$576.743

100+ parts

-

1k+ parts

-

10k+ parts

-

3,366

$576.743

-

-

-

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$648.129

100+ parts

-

1k+ parts

-

10k+ parts

-

200

$648.129

-

-

-

Vyrian

USA . 3,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,684

-

-

-

-

VNN

France . 2,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,119

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 521 parts In-Stock

1+ parts

$11.370

100+ parts

-

1k+ parts

-

10k+ parts

-

521

$11.370

-

-

-

Corohmni

South Africa . 49 parts In-Stock

1+ parts

$42.925

100+ parts

-

1k+ parts

-

10k+ parts

-

49

$42.925

-

-

-

Parana Technologies

USA . 1,063 parts In-Stock

1+ parts

$67.241

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$67.241

-

-

-

IDEA Electronic Components Group

UK . 1,798 parts In-Stock

1+ parts

$75.552

100+ parts

$71.774

1k+ parts

$67.997

10k+ parts

-

1,798

$75.552

$71.774

$67.997

-

ChromeModa Solutions

Germany . 552 parts In-Stock

1+ parts

$75.552

100+ parts

$61.953

1k+ parts

-

10k+ parts

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552

$75.552

$61.953

-

-

Microchip USA

USA . 1,709 parts In-Stock

1+ parts

$425.550

100+ parts

$410.080

1k+ parts

$402.340

10k+ parts

$394.610

1,709

$425.550

$410.080

$402.340

$394.610

Ampacity Inc.

Singapore . 88 parts In-Stock

1+ parts

$516.030

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$516.030

-

-

-

Semicontronic

India . 29 parts In-Stock

1+ parts

$516.030

100+ parts

$503.129

1k+ parts

$500.549

10k+ parts

-

29

$516.030

$503.129

$500.549

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Corphita

USA . 2,189 parts In-Stock

1+ parts

$546.388

100+ parts

-

1k+ parts

-

10k+ parts

-

2,189

$546.388

-

-

-

Argo Parts USA

USA . 4,425 parts In-Stock

1+ parts

$648.129

100+ parts

$641.648

1k+ parts

$635.166

10k+ parts

$628.685

4,425

$648.129

$641.648

$635.166

$628.685

Continental Prestige Electronics

USA . 3,670 parts In-Stock

1+ parts

$648.129

100+ parts

-

1k+ parts

-

10k+ parts

$635.166

3,670

$648.129

-

-

$635.166

Netroflash

USA . 100 parts In-Stock

1+ parts

$648.129

100+ parts

$635.166

1k+ parts

-

10k+ parts

-

100

$648.129

$635.166

-

-

DigiPath Technology Company

USA . 2,121 parts In-Stock

1+ parts

-

100+ parts

$68.118

1k+ parts

-

10k+ parts

-

2,121

-

$68.118

-

-

Overview

Experience unparalleled efficiency and performance with the Texas Instruments 66AK2H06DAAWA24, a cutting-edge multi-functional peripheral designed to meet diverse industry demands. With a reputation for excellence, Texas Instruments delivers top-notch quality and reliability in every product. This versatile device is ideal for applications such as industrial automation, telecommunications, and automotive systems. Offering superior value, benefits, and advantages, this innovative solution is sure to elevate your projects to new heights. Choose Texas Instruments for exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the product easy to handle and transport.

Maximum Supply Voltage: 1.05 V

Higher maximum supply voltage allows for efficient power usage and performance.

RAM Words: 6M

Large RAM capacity of 6 million words allows for smooth multitasking and efficient data processing.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC microprocessor technology offers fast execution of instructions and enhances overall performance.

Bus Compatibility: ETHERNET; I2C; PCI; SPI; UART; USB

Wide range of bus compatibility ensures seamless integration with various systems and devices.

Technical Specifications

Multi-functional Peripherals 66AK2H06DAAWA24 attributes and parameters. Explore more Multi-functional Peripherals devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

YES

Bus Compatibility:

ETHERNET; I2C; PCI; SPI; UART; USB

External Data Bus Width:

128

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

32

No. of Terminals:

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

RAM Words:

6M

Maximum Seated Height:

3.62 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

66AK2H06DAAWA24 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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