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74LVC1G57GV,125

NXP Semiconductors

74LVC1G57GV,125 by NXP Semiconductors

NXP Semiconductors' 74LVC1G57GV,125 is a CMOS logic IC with 7.9ns propagation delay at 1.8V supply voltage. It has a load capacitance of 50pF and operates b/w -40 to 125°C. Ideal for automotive applications due to its Schmitt Trigger feature and small form factor package design.

Median Price

$0.128

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

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DigiKey

USA . 2,614 parts In-Stock

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Mouser Electronics

USA . 1,652 parts In-Stock

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Newark

USA . 850 parts In-Stock

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Future Electronics

Canada . 42,000 parts In-Stock

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Avnet

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Verical

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Arrow

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EBV Elektronik

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Rochester

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Farnell

UK . 850 parts In-Stock

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Element14

Singapore . 850 parts In-Stock

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Chip1Stop

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Nova Conductors

Japan . 300 parts In-Stock

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TME

Poland . 2,250 parts In-Stock

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$0.070

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$0.068

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Digiode

USA . 1,619 parts In-Stock

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Chip Stock

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NAC Semi

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VNN

France . 3,337 parts In-Stock

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Semicontronic

India . 16,518 parts In-Stock

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AZTECH Wire

Italy . 13,503 parts In-Stock

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Netroflash

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Corphita

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Continental Prestige Electronics

USA . 3,905 parts In-Stock

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Microchip USA

USA . 5,961 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,143 parts In-Stock

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Advanced Electronics

New Zealand . 17 parts In-Stock

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Corohmni

South Africa . 233 parts In-Stock

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Perfect Parts

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the 74LVC1G57GV,125 by NXP Semiconductors! This high-quality Other Function Logic IC offers unmatched reliability and performance, backed by the reputable manufacturer. Ideal for a wide range of applications, this product provides fast propagation delay, low power consumption, and versatile surface mount capabilities. Elevate your designs with the value, benefits, and advantages this innovative component brings to the table. Experience efficiency and precision like never before with the 74LVC1G57GV,125 from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product suitable for automotive applications.

Propagation Delay At Nominal Supply: 7.9 ns

Fast propagation delay ensures efficient signal processing and quick response times.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption at a nominal supply voltage, reducing energy usage.

Load Capacitance (CL): 50 pF

Can drive a moderate load capacitance, allowing for versatility in circuit design.

Power Supplies (V): 3.3

Supports a standard power supply voltage for compatibility with common electronic systems.

No. of Terminals: 6

Simplified interface with other components or devices in the circuit.

Maximum I (ol): 24 Amp

Can handle high output current, enabling the IC to drive multiple components without overheating.

Maximum Operating Temperature: 125 °C

Wide operating temperature range suitable for automotive or industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a variety of operating conditions.

Terminal Finish: Tin (Sn)

Provides good electrical conductivity and corrosion resistance for reliable connections.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliability and performance in harsh environments.

Schmitt Trigger: YES

Incorporates Schmitt trigger functionality for noise immunity and stable signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Other Function Logic ICs 74LVC1G57GV,125 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

74LVC1G57GV,125 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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