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SN74AUP1G99DCTTG4

Texas Instruments

SN74AUP1G99DCTTG4 by Texas Instruments

SN74AUP1G99DCTTG4 by Texas Instruments is a CMOS logic IC with 36.1ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It is ideal for industrial applications requiring a small outline package with Schmitt Trigger functionality and 3-state output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,596 parts In-Stock

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Digiode

USA . 3,343 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 521 parts In-Stock

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$10.000

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521

$10.000

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Parana Technologies

USA . 1,296 parts In-Stock

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$10.980

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$11.440

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$11.440

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DigiPath Technology Company

USA . 2,358 parts In-Stock

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$12.090

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$11.123

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ChromeModa Solutions

Germany . 3,816 parts In-Stock

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$12.337

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$10.116

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$10.116

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IDEA Electronic Components Group

UK . 2,324 parts In-Stock

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$12.337

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$11.720

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$11.103

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2,324

$12.337

$11.720

$11.103

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AZTECH Wire

Italy . 434 parts In-Stock

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$19.142

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Corphita

USA . 2,701 parts In-Stock

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Overview

Discover the versatility and reliability of the SN74AUP1G99DCTTG4 by Texas Instruments, a cutting-edge Other Function Logic IC that promises top-notch performance and efficiency. With a focus on quality and innovation, Texas Instruments ensures that this product meets the highest standards in the industry. Ideal for a wide range of applications, this IC offers customers unparalleled value with its fast propagation delay, low power consumption, and wide operating temperature range. Trust Texas Instruments to deliver exceptional solutions for your electronic needs with the SN74AUP1G99DCTTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Propagation Delay At Nominal Supply: 36.1 ns

Fast propagation delay ensures quick response times, making the product efficient in processing signals.

Surface Mount: YES

Ease of installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.1

Optimal supply voltage for efficient performance and power consumption.

Load Capacitance (CL): 30 pF

Suitable load capacitance for smooth signal transmission and operation.

Power Supplies (V): 1.2/3.3

Compatibility with multiple power supply voltages for versatile applications.

No. of Terminals: 8

Sufficient number of terminals for connectivity and communication with other components.

Maximum I (ol): 1.7 Amp

High maximum output current allows for driving various loads with ease.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for reliable performance in diverse environments.

Output Characteristics: 3-STATE

3-state output allows for high impedance when not driving a load, enhancing flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperature conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for reliable connections and longevity of the product.

Terminal Position: DUAL

Dual terminal positioning for stable and secure mounting on circuit boards.

Width: 2.8 mm

Compact width for space-saving installation in electronic devices.

Minimum Supply Voltage (Vsup): 0.8 V

Low minimum supply voltage enables operation even in low power situations.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust soldering during manufacturing processes.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability in harsh operating conditions.

Schmitt Trigger: YES

Presence of Schmitt trigger for noise tolerance and improved signal stability.

Terminal Form: GULL WING

Gull wing terminal form for secure attachment to PCBs and efficient soldering.

Terminal Pitch: 0.65 mm

Optimal terminal pitch for easy assembly and compatibility with standard PCB designs.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage capability for handling various power sources.

Technical Specifications

Other Function Logic ICs SN74AUP1G99DCTTG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

36.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.3 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.8 mm

Trade Compliance

SN74AUP1G99DCTTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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