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SN74LS444NP1

Texas Instruments

SN74LS444NP1 by Texas Instruments

SN74LS444NP1 by Texas Instruments is a TTL logic IC with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. This IC is commonly used in commercial applications requiring dual terminal positions and operates within a temperature range of 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,047 parts In-Stock

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4,047

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Digiode

USA . 714 parts In-Stock

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714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$14.422

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762

$14.422

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Parana Technologies

USA . 959 parts In-Stock

1+ parts

$23.613

100+ parts

$2,192.870

1k+ parts

$21.252

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959

$23.613

$2,192.870

$21.252

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$26.001

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1,097

$26.001

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ChromeModa Solutions

Germany . 665 parts In-Stock

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$26.532

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$21.756

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665

$26.532

$21.756

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IDEA Electronic Components Group

UK . 386 parts In-Stock

1+ parts

$26.532

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$25.205

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$23.879

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386

$26.532

$25.205

$23.879

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One Stop Electronics

USA . 617 parts In-Stock

1+ parts

$46.000

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617

$46.000

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Corphita

USA . 907 parts In-Stock

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907

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Overview

Discover the innovative SN74LS444NP1 by Texas Instruments, a high-quality Other Function Logic IC that offers unmatched performance and reliability. Manufactured by the industry leader, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile IC delivers exceptional value and benefits to customers. Upgrade your designs with the SN74LS444NP1 and experience the advantages of cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring easy handling and long-term reliability.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy integration into circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand extended use without overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for use in various environments and conditions.

Technology: TTL

Utilizing Transistor-Transistor Logic (TTL) technology ensures fast switching speeds and reliable performance in digital circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and provides a secure mechanical connection to the circuit board.

Technical Specifications

Other Function Logic ICs SN74LS444NP1 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS444NP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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