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SN54LS628W

Texas Instruments

SN54LS628W by Texas Instruments

SN54LS628W by Texas Instruments is a TTL technology logic IC with 14 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and comes in a ceramic, glass-sealed rectangular package suitable for military-grade applications. The flatpack style IC is surface-mountable and features dual terminal positions, making it versatile for various electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,662 parts In-Stock

1+ parts

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8,662

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Digiode

USA . 3,389 parts In-Stock

1+ parts

-

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3,389

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 897 parts In-Stock

1+ parts

$6.395

100+ parts

-

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897

$6.395

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Parana Technologies

USA . 707 parts In-Stock

1+ parts

$15.402

100+ parts

-

1k+ parts

$15.787

10k+ parts

-

707

$15.402

-

$15.787

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IDEA Electronic Components Group

UK . 1,143 parts In-Stock

1+ parts

$17.306

100+ parts

$16.441

1k+ parts

$15.575

10k+ parts

-

1,143

$17.306

$16.441

$15.575

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ChromeModa Solutions

Germany . 266 parts In-Stock

1+ parts

$17.306

100+ parts

$14.191

1k+ parts

-

10k+ parts

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266

$17.306

$14.191

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One Stop Electronics

USA . 1,643 parts In-Stock

1+ parts

$64.000

100+ parts

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1,643

$64.000

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Corphita

USA . 1,757 parts In-Stock

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1,757

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DigiPath Technology Company

USA . 834 parts In-Stock

1+ parts

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100+ parts

$15.603

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834

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$15.603

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Overview

Enhance your electronic projects with the SN54LS628W by Texas Instruments, a top-quality Other Function Logic IC designed to deliver reliable performance. With a MILITARY-grade temperature grade and flatpack package style, this component is ideal for a wide range of applications. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing to ensure your projects run smoothly. Upgrade your systems with the SN54LS628W and experience the value, benefits, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Ease of installation and compact size make this product suitable for space-constrained applications.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage, ensuring compatibility with various systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial or harsh environments.

Technology: TTL

Uses TTL technology known for its reliability and simplicity, making the product a trusted choice for logic applications.

Technical Specifications

Other Function Logic ICs SN54LS628W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F14

Length:

9.21 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.29 mm

Trade Compliance

SN54LS628W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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