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SN74LVC1G98DBVTG4

Texas Instruments

SN74LVC1G98DBVTG4 by Texas Instruments

SN74LVC1G98DBVTG4 by Texas Instruments is a CMOS logic IC with 6.3ns propagation delay, suitable for automotive applications. Operating at 1.8V to 5.5V, it features Schmitt Trigger technology and can handle up to 24A of current with a load capacitance of 50pF. This small outline package has dual terminals and is surface mountable for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,159 parts In-Stock

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Digiode

USA . 202 parts In-Stock

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202

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Distributors (Availability)

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AZTECH Wire

Italy . 594 parts In-Stock

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$12.774

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594

$12.774

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Parana Technologies

USA . 1,171 parts In-Stock

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$26.772

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$28.445

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$26.772

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One Stop Electronics

USA . 1,632 parts In-Stock

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$29.000

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$29.000

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ChromeModa Solutions

Germany . 6,071 parts In-Stock

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$30.081

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$24.666

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6,071

$30.081

$24.666

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IDEA Electronic Components Group

UK . 441 parts In-Stock

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$30.081

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$28.577

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$27.073

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441

$30.081

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$27.073

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DigiPath Technology Company

USA . 1,978 parts In-Stock

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$27.121

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Corphita

USA . 600 parts In-Stock

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Overview

Looking for high-quality logic ICs? Look no further than the SN74LVC1G98DBVTG4 by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-notch products like this one, perfect for a variety of applications in the Other Function Logic ICs category. This small outline, low profile IC offers a propagation delay of just 6.3 ns and operates on a nominal supply voltage of 1.8V, making it both efficient and reliable. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for a variety of applications.

Propagation Delay At Nominal Supply: 6.3 ns

Fast propagation delay ensures quick signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for low-power applications.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive operating conditions, ensuring reliability in harsh environments.

Schmitt Trigger: YES

Incorporates Schmitt trigger functionality for hysteresis, ensuring signal integrity and noise immunity.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-powered devices.

Technical Specifications

Other Function Logic ICs SN74LVC1G98DBVTG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G98DBVTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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