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SN74ALS6311ADW

Texas Instruments

SN74ALS6311ADW by Texas Instruments

SN74ALS6311ADW by Texas Instruments is a TTL technology logic IC with 20 terminals and a supply voltage of 5V. It operates b/w 0°C to 70°C, suitable for commercial applications. This rectangular-shaped IC in a small outline package is surface-mountable, making it ideal for various other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,019 parts In-Stock

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4,019

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Digiode

USA . 2,950 parts In-Stock

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2,950

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Cyclops Electronics Ltd

UK . 501 parts In-Stock

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501

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Legend Electronics Inc.

USA . 123 parts In-Stock

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123

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 313 parts In-Stock

1+ parts

$13.118

100+ parts

-

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$13.619

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313

$13.118

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$13.619

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DigiPath Technology Company

USA . 1,770 parts In-Stock

1+ parts

$14.444

100+ parts

$13.289

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1,770

$14.444

$13.289

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ChromeModa Solutions

Germany . 1,332 parts In-Stock

1+ parts

$14.739

100+ parts

$12.086

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1,332

$14.739

$12.086

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IDEA Electronic Components Group

UK . 1,236 parts In-Stock

1+ parts

$14.739

100+ parts

$14.002

1k+ parts

$13.265

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1,236

$14.739

$14.002

$13.265

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AZTECH Wire

Italy . 288 parts In-Stock

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$18.193

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288

$18.193

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One Stop Electronics

USA . 144 parts In-Stock

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$20.000

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144

$20.000

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Corphita

USA . 622 parts In-Stock

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Kepictronics

USA . 324 parts In-Stock

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324

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock endless possibilities with the SN74ALS6311ADW by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers cutting-edge technology in the category of Other Function Logic ICs. This product offers unparalleled value and benefits, making it a must-have for a wide range of applications. From enhancing efficiency to boosting performance, the SN74ALS6311ADW is the ultimate solution for all your electronic needs. Experience the advantages of this product and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient usage of space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage makes this IC compatible with a wide range of electronic devices.

No. of Terminals: 20

Having 20 terminals provides flexibility for connecting to various components in a circuit.

Technology: TTL

TTL technology offers high speed and low power consumption, making this IC suitable for a variety of applications.

Technical Specifications

Other Function Logic ICs SN74ALS6311ADW attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ALS6311ADW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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