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NLV7SZ58DFT2G

Onsemi

NLV7SZ58DFT2G by Onsemi

NLV7SZ58DFT2G by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65-5.5V and AEC-Q101 screening level for automotive applications. The package style is small outline, thin profile, suitable for military-grade temperature requirements.

Median Price

$0.048

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 21,000 parts In-Stock

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$0.046

21,000

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$0.046

Rochester

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

$0.050

1k+ parts

$0.042

10k+ parts

$0.037

21,000

-

$0.050

$0.042

$0.037

Distributors (In-Stock)

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Digiode

USA . 1,435 parts In-Stock

1+ parts

$0.041

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1,435

$0.041

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Flip Electronics

USA . 250,000 parts In-Stock

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Vyrian

USA . 5,446 parts In-Stock

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J2 Sourcing AB

Sweden . 1,025 parts In-Stock

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1,025

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Distributors (Availability)

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Corphita

USA . 80 parts In-Stock

1+ parts

$0.039

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80

$0.039

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Corohmni

South Africa . 266 parts In-Stock

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$0.043

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266

$0.043

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Component Stockers USA

USA . 16,292 parts In-Stock

1+ parts

$0.380

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16,292

$0.380

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Vigor

Singapore . 658 parts In-Stock

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$0.420

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658

$0.420

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Microchip USA

USA . 5,400 parts In-Stock

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$0.937

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5,400

$0.937

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AZTECH Wire

Italy . 224 parts In-Stock

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$16.110

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224

$16.110

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GreenTree Electronics

Israel . 573,000 parts In-Stock

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Continental Prestige Electronics

USA . 14,560 parts In-Stock

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$0.129

1k+ parts

$0.125

10k+ parts

$0.118

14,560

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$0.129

$0.125

$0.118

QUARKTWIN TECHNOLOGY LTD

USA . 8,713 parts In-Stock

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Problanco Electronics

Mexico . 5,523 parts In-Stock

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5,523

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Kulean Microsystems

USA . 4,987 parts In-Stock

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TANS Electronics

Latvia . 2,995 parts In-Stock

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SupplyDigital Components

Austria . 2,636 parts In-Stock

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2,636

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UHIMA Technologies

Türkiye . 952 parts In-Stock

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952

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Overview

Unlock the potential of your electronic devices with the NLV7SZ58DFT2G by Onsemi. This high-quality Other Function Logic IC boasts top-tier manufacturing by Onsemi, ensuring reliability and performance. Ideal for a wide range of applications, this product offers exceptional value through its advanced technology and durable construction. Experience the benefits of seamless integration, efficiency, and precision with the NLV7SZ58DFT2G - the perfect choice for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the IC, ensuring durability and longevity.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q101

Meets automotive industry standards for reliability and quality, making it suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and stable supply voltage, making it compatible with a wide range of systems.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely low temperature environments, ensuring reliability in harsh conditions.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, suitable for a variety of applications.

Temperature Grade: MILITARY

Designed and tested to meet military-grade standards, ensuring reliability and quality in demanding conditions.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Other Function Logic ICs NLV7SZ58DFT2G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q101

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

NLV7SZ58DFT2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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