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THCT2000N

Texas Instruments

THCT2000N by Texas Instruments

THCT2000N by Texas Instruments is a 28-terminal logic IC in rectangular plastic/epoxy package. It features dual terminal position with 2.54mm pitch, suitable for various applications requiring other function logic ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,740

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-

-

-

Digiode

USA . 1,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,526

-

-

-

-

Digital Electronic Gebert Verwaltungs UG

Germany . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 463 parts In-Stock

1+ parts

$6.097

100+ parts

-

1k+ parts

-

10k+ parts

-

463

$6.097

-

-

-

Parana Technologies

USA . 1,491 parts In-Stock

1+ parts

$29.754

100+ parts

$2,763.072

1k+ parts

$26.778

10k+ parts

-

1,491

$29.754

$2,763.072

$26.778

-

DigiPath Technology Company

USA . 129 parts In-Stock

1+ parts

$32.762

100+ parts

$30.141

1k+ parts

-

10k+ parts

-

129

$32.762

$30.141

-

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IDEA Electronic Components Group

UK . 1,092 parts In-Stock

1+ parts

$33.431

100+ parts

$31.759

1k+ parts

$30.088

10k+ parts

-

1,092

$33.431

$31.759

$30.088

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ChromeModa Solutions

Germany . 900 parts In-Stock

1+ parts

$33.431

100+ parts

$27.413

1k+ parts

-

10k+ parts

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900

$33.431

$27.413

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One Stop Electronics

USA . 1,046 parts In-Stock

1+ parts

$42.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,046

$42.000

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-

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Corphita

USA . 1,337 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,337

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Overview

Experience maximum efficiency and reliability with the THCT2000N by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge solutions in the field of Other Function Logic ICs. This versatile component is ideal for a wide range of applications, offering customers unmatched value and performance. Trust in Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection against external elements, ensuring the long-term reliability of the product.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient and space-saving integration into electronic circuits or systems.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for complex circuit designs and functionalities.

Package Style (Meter): IN-LINE

The in-line package style offers ease of installation and maintenance in various applications.

Terminal Position: DUAL

Dual terminal position allows for better stability and connectivity, contributing to the overall performance of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure mounting and soldering, enhancing the product's mechanical strength and reliability.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm offers compatibility with standard PCB designs, making it easier to integrate the product into existing electronic systems.

Technical Specifications

Other Function Logic ICs THCT2000N attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

Logic IC Type:

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

THCT2000N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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