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THCT2000EFN

Texas Instruments

THCT2000EFN by Texas Instruments

THCT2000EFN by Texas Instruments is a 28-terminal logic IC in a square chip carrier package. With an operating temperature range of -40 to 85°C, it's ideal for industrial applications. This surface-mount device features J-bend terminals and is made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,204 parts In-Stock

1+ parts

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6,204

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Digiode

USA . 4,499 parts In-Stock

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4,499

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,246 parts In-Stock

1+ parts

$9.618

100+ parts

-

1k+ parts

$10.212

10k+ parts

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1,246

$9.618

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$10.212

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DigiPath Technology Company

USA . 1,578 parts In-Stock

1+ parts

$10.591

100+ parts

-

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1,578

$10.591

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ChromeModa Solutions

Germany . 6,607 parts In-Stock

1+ parts

$10.807

100+ parts

$8.862

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-

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6,607

$10.807

$8.862

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IDEA Electronic Components Group

UK . 2,181 parts In-Stock

1+ parts

$10.807

100+ parts

$10.267

1k+ parts

$9.726

10k+ parts

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2,181

$10.807

$10.267

$9.726

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AZTECH Wire

Italy . 574 parts In-Stock

1+ parts

$19.702

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574

$19.702

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One Stop Electronics

USA . 1,327 parts In-Stock

1+ parts

$41.000

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1,327

$41.000

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Corphita

USA . 2,007 parts In-Stock

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2,007

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Overview

Discover the unparalleled quality and reliability of the THCT2000EFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures that this Other Function Logic IC meets the highest standards for performance and durability. With a wide range of applications in various industries, this product offers customers exceptional value and benefits. Whether you're looking to optimize your system's efficiency or improve its overall functionality, the THCT2000EFN is the perfect solution for your needs. Experience the advantages of Texas Instruments technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good insulation properties and can withstand high temperatures, making it ideal for industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing overall weight of the product.

Package Shape: SQUARE

Square package shape is compact and helps in efficient use of space on the PCB, making it suitable for smaller electronic devices.

No. of Terminals: 28

Having 28 terminals allows for more connectivity options, making this product versatile and suitable for complex circuit designs.

Package Style: CHIP CARRIER

Chip carrier package style provides protection to the IC and allows for easy handling and installation during the manufacturing process.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can perform reliably in harsh industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the IC can operate in cold environments without any performance issues.

Terminal Position: QUAD

Quad terminal position provides good stability and connectivity, allowing for reliable performance in various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the IC can withstand temperature fluctuations common in industrial settings, making it a durable choice.

Terminal Form: J BEND

J bend terminal form offers secure connections and ease of soldering, ensuring reliable electrical connections in the circuit.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides a good balance between spacing and connectivity, allowing for compact design and efficient PCB layout.

Technical Specifications

Other Function Logic ICs THCT2000EFN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Logic IC Type:

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

THCT2000EFN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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