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SN74CB3T16212DGGRE4

Texas Instruments

SN74CB3T16212DGGRE4 by Texas Instruments

SN74CB3T16212DGGRE4 by Texas Instruments is a CMOS logic IC with 56 terminals, operating at temperatures from -40 to 85°C. It has power supplies of 2.5/3.3V and comes in a small outline package for surface mounting applications. Ideal for industrial use due to its robust design and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,707 parts In-Stock

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8,707

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Digiode

USA . 4,734 parts In-Stock

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4,734

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Distributors (Availability)

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AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$6.750

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790

$6.750

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One Stop Electronics

USA . 1,560 parts In-Stock

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$17.000

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1,560

$17.000

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Parana Technologies

USA . 326 parts In-Stock

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$22.519

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$23.186

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326

$22.519

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$23.186

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DigiPath Technology Company

USA . 2,275 parts In-Stock

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$24.796

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$22.812

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2,275

$24.796

$22.812

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

1+ parts

$25.302

100+ parts

$24.037

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$22.772

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1,093

$25.302

$24.037

$22.772

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ChromeModa Solutions

Germany . 685 parts In-Stock

1+ parts

$25.302

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$20.748

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685

$25.302

$20.748

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Corphita

USA . 299 parts In-Stock

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299

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Overview

Discover the unparalleled quality and innovation of the Texas Instruments SN74CB3T16212DGGRE4, a cutting-edge Other Function Logic IC that is revolutionizing the industry. With its advanced technology and industrial-grade temperature tolerance, this product offers unmatched reliability and performance. Whether you're in need of high-speed data switching or voltage level translation, this versatile IC has got you covered. Trust Texas Instruments to deliver superior products that exceed expectations and elevate your projects to new heights. Unlock the potential of your designs with the SN74CB3T16212DGGRE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the IC.

Surface Mount: YES

The surface mount capability makes it easier to integrate this IC into electronic circuits, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular shape allows for easier placement and orientation on a circuit board, enhancing the overall design efficiency.

Power Supplies (V): 2.5/3.3

Support for multiple power supplies makes this IC versatile and compatible with a variety of electronic systems.

No. of Terminals: 56

With 56 terminals, this IC offers extensive connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package ensure space-saving and efficient use of board real estate in electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this IC to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that this IC can operate effectively even in extreme cold environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in connecting the IC to external components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification ensures that this IC can withstand harsh industrial environments with high temperature variations.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption, high speed, and compatibility with a wide range of electronic devices.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy surface mounting and soldering onto the circuit board, enhancing the overall reliability of the connection.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density packaging and precise connections in tight spaces on the circuit board.

Technical Specifications

Other Function Logic ICs SN74CB3T16212DGGRE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

SN74CB3T16212DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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