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SNJ54LS629W

Texas Instruments

SNJ54LS629W by Texas Instruments

SNJ54LS629W by Texas Instruments is a TTL logic IC with 2 functions, 15ns propagation delay, and 5V nominal voltage. It is used in military-grade applications requiring fast signal processing and operates within a temperature range of -55 to 125°C. This ceramic, glass-sealed IC has a flatpack package style with dual terminals for surface mount assembly.

Median Price

$17.278

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 10 parts In-Stock

1+ parts

$17.278

100+ parts

$18.142

1k+ parts

$17.105

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10

$17.278

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$17.105

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Vyrian

USA . 5,231 parts In-Stock

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Digiode

USA . 3,741 parts In-Stock

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3,741

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Distributors (Availability)

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AZTECH Wire

Italy . 753 parts In-Stock

1+ parts

$8.758

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$8.758

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Parana Technologies

USA . 155 parts In-Stock

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$23.651

100+ parts

$2,196.341

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$21.286

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155

$23.651

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DigiPath Technology Company

USA . 1,538 parts In-Stock

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$26.043

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$23.959

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ChromeModa Solutions

Germany . 2,560 parts In-Stock

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$26.574

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$21.791

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$26.574

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IDEA Electronic Components Group

UK . 1,382 parts In-Stock

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$26.574

100+ parts

$25.245

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$23.917

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$26.574

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One Stop Electronics

USA . 1,240 parts In-Stock

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$31.000

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Microchip USA

USA . 1,827 parts In-Stock

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Corphita

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Overview

Discover the power of Texas Instruments with the SNJ54LS629W, a top-of-the-line Other Function Logic IC. With a reputation for excellence in technology, Texas Instruments delivers unmatched quality and reliability. This versatile 2-bit IC is perfect for a wide range of applications, offering fast propagation delays and efficient performance. Trust in Texas Instruments to provide cutting-edge solutions that exceed expectations and drive innovation in your projects. Unlock the potential of your designs with the SNJ54LS629W today.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast response time, making it suitable for applications requiring quick processing.

No. of Functions: 2

Provides increased functionality in a single component, saving space and simplifying design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, ensuring compatibility with standard power sources.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Technology: TTL

Uses TTL technology which is known for its high speed and reliability, making it a dependable choice for logic operations.

Technical Specifications

Other Function Logic ICs SNJ54LS629W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Length:

10.16 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54LS629W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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