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SNJ54ABTH16260WD

Texas Instruments

SNJ54ABTH16260WD by Texas Instruments

SNJ54ABTH16260WD by Texas Instruments is a ceramic package logic IC with 56 terminals, operating b/w -55°C to 125°C. It has a nominal voltage of 5V and is suitable for military-grade applications requiring high reliability and performance in harsh environments. This rectangular flatpack IC supports surface mount installation and features dual terminal positions with a terminal pitch of 0.635mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,236

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-

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Digiode

USA . 4,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 279 parts In-Stock

1+ parts

$5.525

100+ parts

-

1k+ parts

-

10k+ parts

-

279

$5.525

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-

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Parana Technologies

USA . 2,125 parts In-Stock

1+ parts

$7.553

100+ parts

-

1k+ parts

$8.063

10k+ parts

-

2,125

$7.553

-

$8.063

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DigiPath Technology Company

USA . 1,415 parts In-Stock

1+ parts

$8.316

100+ parts

$7.651

1k+ parts

-

10k+ parts

-

1,415

$8.316

$7.651

-

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ChromeModa Solutions

Germany . 3,153 parts In-Stock

1+ parts

$8.486

100+ parts

$6.959

1k+ parts

-

10k+ parts

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3,153

$8.486

$6.959

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IDEA Electronic Components Group

UK . 1,596 parts In-Stock

1+ parts

$8.486

100+ parts

$8.062

1k+ parts

$7.637

10k+ parts

-

1,596

$8.486

$8.062

$7.637

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One Stop Electronics

USA . 1,368 parts In-Stock

1+ parts

$50.000

100+ parts

-

1k+ parts

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10k+ parts

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1,368

$50.000

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Corphita

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,500

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Overview

Elevate your electronic designs with the SNJ54ABTH16260WD by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. This Other Function Logic IC offers unparalleled performance and precision, making it the ideal choice for demanding projects. With a ceramic package body material and military-grade temperature grade, this IC ensures durability and reliability in even the harshest conditions. Trust Texas Instruments to provide you with the cutting-edge technology you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and helps in dissipating heat efficiently, making the product more reliable and long-lasting.

Surface Mount: YES

Surface mount design allows for easy and convenient installation, saving space on the PCB and reducing assembly time.

Screening Level: 38535Q/M;38534H;883B

Compliance with screening levels ensures high reliability and performance in demanding military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems and circuits.

Maximum Operating Temperature: 125 °C

Capability to operate at high temperatures makes this product suitable for extreme environments and industrial applications.

Minimum Operating Temperature: -55 °C

Wide temperature range allows the product to function reliably in harsh cold conditions, making it versatile for various operating environments.

Temperature Grade: MILITARY

Military-grade components are designed to meet rigorous standards for performance and reliability in critical mission-critical systems.

Technical Specifications

Other Function Logic ICs SNJ54ABTH16260WD attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F56

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL56,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54ABTH16260WD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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