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SNJ54LS325J-00

Texas Instruments

SNJ54LS325J-00 by Texas Instruments

SNJ54LS325J-00 by Texas Instruments is a TTL technology IC with 2 functions, operating at -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in an IN-LINE package style. Ideal for military-grade applications requiring reliable logic functions in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,099 parts In-Stock

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5,099

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Digiode

USA . 4,382 parts In-Stock

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4,382

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Distributors (Availability)

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AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$15.675

100+ parts

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698

$15.675

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Parana Technologies

USA . 1,939 parts In-Stock

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$22.592

100+ parts

-

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$23.249

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1,939

$22.592

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$23.249

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ChromeModa Solutions

Germany . 4,698 parts In-Stock

1+ parts

$25.384

100+ parts

$20.815

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4,698

$25.384

$20.815

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

1+ parts

$25.384

100+ parts

$24.115

1k+ parts

$22.846

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2,281

$25.384

$24.115

$22.846

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One Stop Electronics

USA . 1,579 parts In-Stock

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$35.000

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1,579

$35.000

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Corphita

USA . 3,019 parts In-Stock

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3,019

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DigiPath Technology Company

USA . 498 parts In-Stock

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$22.886

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498

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$22.886

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Overview

Unlock a world of possibilities with the SNJ54LS325J-00 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-quality components that exceed expectations. The SNJ54LS325J-00 falls under the category of Other Function Logic ICs, offering versatility and reliability for various applications. With its MILITARY grade temperature rating and TTL technology, this component ensures optimal performance in extreme conditions. Trust Texas Instruments to provide you with superior products that deliver value, benefits, and unmatched advantages to meet your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability, making this product suitable for harsh operating conditions.

No. of Functions: 2

Having 2 functions in one IC increases the efficiency and performance of the product, allowing for more capabilities in a single component.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easy.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand prolonged use in temperature-sensitive environments without compromising performance.

Technology: TTL

Utilizing TTL technology ensures fast response times and reliable operation, making it a preferred choice for applications requiring precision and speed.

Technical Specifications

Other Function Logic ICs SNJ54LS325J-00 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SNJ54LS325J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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