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SNJ54LS626W

Texas Instruments

SNJ54LS626W by Texas Instruments

SNJ54LS626W by Texas Instruments is a TTL logic IC with 2 functions, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in a ceramic-metal flatpack package style. Ideal for military-grade applications requiring dual terminals and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,364 parts In-Stock

1+ parts

-

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4,364

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Digiode

USA . 3,264 parts In-Stock

1+ parts

-

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3,264

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 895 parts In-Stock

1+ parts

$12.073

100+ parts

-

1k+ parts

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10k+ parts

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895

$12.073

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One Stop Electronics

USA . 1,562 parts In-Stock

1+ parts

$17.000

100+ parts

-

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1,562

$17.000

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Parana Technologies

USA . 1,369 parts In-Stock

1+ parts

$29.635

100+ parts

-

1k+ parts

$61.448

10k+ parts

-

1,369

$29.635

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$61.448

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DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

$32.632

100+ parts

$30.021

1k+ parts

-

10k+ parts

-

2,046

$32.632

$30.021

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ChromeModa Solutions

Germany . 2,183 parts In-Stock

1+ parts

$33.298

100+ parts

$27.304

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2,183

$33.298

$27.304

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IDEA Electronic Components Group

UK . 1,451 parts In-Stock

1+ parts

$33.298

100+ parts

$31.633

1k+ parts

$29.968

10k+ parts

-

1,451

$33.298

$31.633

$29.968

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Corphita

USA . 394 parts In-Stock

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394

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Overview

Enhance your electronic projects with the SNJ54LS626W from Texas Instruments, a top-quality manufacturer known for reliable and innovative products. This versatile logic IC offers endless possibilities in various applications, providing customers with exceptional value and unmatched performance. With its durable ceramic and metal-sealed co-fired package body material, dual functions, and military-grade temperature tolerance, this product is sure to exceed your expectations. Upgrade your designs with Texas Instruments' SNJ54LS626W for superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and resistance to harsh environmental conditions, making this product reliable for long-term use.

Surface Mount: YES

Surface mount option allows for easy and efficient PCB assembly, saving time and effort during production.

No. of Functions: 2

Having multiple functions in a single IC provides versatility and functionality, making it a cost-effective solution for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources and ensures stability in performance.

Package Style (Meter): FLATPACK

The flatpack package style offers space-saving benefits and ease of integration into compact electronic designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand elevated heat levels without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows the IC to function reliably even in extreme cold environments.

Technology: TTL

Utilizing TTL technology ensures high-speed operation and compatibility with existing TTL-based systems, enhancing overall performance.

Technical Specifications

Other Function Logic ICs SNJ54LS626W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-CDFP-F16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54LS626W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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