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SN74LVC1G97YZAR

Texas Instruments

SN74LVC1G97YZAR by Texas Instruments

SN74LVC1G97YZAR by Texas Instruments features a propagation delay of 6.3ns, operating at 1.8V with a load capacitance of 50pF. This CMOS technology IC is ideal for industrial applications requiring a 3-STATE output and Schmitt Trigger functionality in a compact GRID ARRAY package with very thin profile and fine pitch terminals.

Median Price

$0.470

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,000 parts In-Stock

1+ parts

$0.330

100+ parts

$0.320

1k+ parts

$0.320

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-

18,000

$0.330

$0.320

$0.320

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DigiKey

USA . 333 parts In-Stock

1+ parts

$0.610

100+ parts

$0.335

1k+ parts

$0.311

10k+ parts

$0.261

333

$0.610

$0.335

$0.311

$0.261

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 649 parts In-Stock

1+ parts

$0.360

100+ parts

-

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-

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649

$0.360

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-

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Vyrian

USA . 711 parts In-Stock

1+ parts

$0.379

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-

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-

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711

$0.379

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-

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DigiKey Marketplace

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

$0.390

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-

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18,000

-

$0.390

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,609 parts In-Stock

1+ parts

$0.341

100+ parts

-

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-

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1,609

$0.341

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-

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Parana Technologies

USA . 1,913 parts In-Stock

1+ parts

$12.572

100+ parts

-

1k+ parts

$13.025

10k+ parts

-

1,913

$12.572

-

$13.025

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DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

$13.843

100+ parts

-

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-

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787

$13.843

-

-

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ChromeModa Solutions

Germany . 6,914 parts In-Stock

1+ parts

$14.126

100+ parts

$11.583

1k+ parts

-

10k+ parts

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6,914

$14.126

$11.583

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IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$14.126

100+ parts

$13.420

1k+ parts

$12.713

10k+ parts

-

26

$14.126

$13.420

$12.713

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Microchip USA

USA . 460 parts In-Stock

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460

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Overview

Elevate your projects with the SN74LVC1G97YZAR by Texas Instruments, a top-quality Other Function Logic IC that delivers exceptional performance and reliability. With Texas Instruments' renowned reputation for excellence in semiconductor manufacturing, this IC is ideal for a wide range of applications. Experience the value and benefits of this product with its ultra-fast propagation delay, low power consumption, and versatile 3-STATE output characteristics. Trust in Texas Instruments for cutting-edge technology that meets all your electronics needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast performance and efficient operation.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient.

Load Capacitance (CL): 50 pF

Capable of handling a moderate load capacitance for reliable operation.

Output Characteristics: 3-STATE

3-state output provides flexibility in controlling the output signal.

Technology: CMOS

CMOS technology results in low power consumption and high noise immunity.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Technical Specifications

Other Function Logic ICs SN74LVC1G97YZAR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B6

Length:

1.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74LVC1G97YZAR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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