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CD4048BF3A

Texas Instruments

CD4048BF3A by Texas Instruments

CD4048BF3A by Texas Instruments is a CMOS logic IC with 16 terminals and 3-STATE output. It operates b/w -55 to 125 °C, with Vsup ranging from 3V to 18V. With a propagation delay of 600ns, it's ideal for military applications requiring high-speed signal processing in harsh environments.

Median Price

$17.905

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 77 parts In-Stock

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$19.687

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$17.915

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$16.143

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77

$19.687

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Arrow

USA . 25 parts In-Stock

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$16.123

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$15.720

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$15.720

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Digiode

USA . 900 parts In-Stock

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$18.703

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Vyrian

USA . 5,437 parts In-Stock

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Chip Stock

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LWI Electronics Inc

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Q Components

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Mil-Aero Solutions, Inc.

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Electronic Expediters

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NAC Semi

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Native Components

USA . 529 parts In-Stock

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$0.232

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$0.223

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Northwest PG Solutions

USA . 29 parts In-Stock

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$0.255

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Parana Technologies

USA . 951 parts In-Stock

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$7.841

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$8.395

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DigiPath Technology Company

USA . 1,364 parts In-Stock

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$8.634

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ChromeModa Solutions

Germany . 6,189 parts In-Stock

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$7.224

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IDEA Electronic Components Group

UK . 1,737 parts In-Stock

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$7.929

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Corohmni

South Africa . 50 parts In-Stock

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Corphita

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Advanced Electronics

New Zealand . 77 parts In-Stock

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$17.915

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Component Stockers USA

USA . 8,350 parts In-Stock

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Supply Digital

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Microchip USA

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Overview

Looking for top-notch quality and reliability in your logic ICs? Look no further than the CD4048BF3A by Texas Instruments. With a reputation for excellence, Texas Instruments delivers cutting-edge technology that meets the stringent demands of various applications. This versatile IC offers customers unparalleled value with its high performance and efficiency. Whether you're designing consumer electronics, industrial automation, or telecommunications systems, the CD4048BF3A is the perfect solution for all your logic needs. Trust Texas Instruments to deliver superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 600 ns

The low propagation delay at nominal supply ensures fast and efficient operation.

Screening Level: 38535Q/M;38534H;883B

The high screening level ensures quality and reliability in performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is commonly available, making it easy to integrate into existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing power consumption and improving efficiency.

Power Supplies (V): 5/15

Support for multiple power supply voltages allows for flexibility in different operating environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristic provides additional control options for the user.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh conditions.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it a reliable choice.

Technical Specifications

Other Function Logic ICs CD4048BF3A attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Additional Features:

CONFIGURABLE AS NOR/OR/NAND/AND/OR-AND/OR-NAND/AND-NOR; EXPANDABLE

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

1.5 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD4048BF3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-174-1384, 5962011741384

NIIN

011741384

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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