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SN74LS444DW3

Texas Instruments

SN74LS444DW3 by Texas Instruments

SN74LS444DW3 by Texas Instruments is a TTL technology logic IC with 20 terminals in a small outline package. It operates at temperatures from 0 to 70°C and has a nominal voltage of 5V. This IC is commonly used in applications requiring other function logic, featuring a rectangular package shape suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,505 parts In-Stock

1+ parts

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2,505

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Digiode

USA . 2,283 parts In-Stock

1+ parts

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2,283

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 408 parts In-Stock

1+ parts

$14.489

100+ parts

-

1k+ parts

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408

$14.489

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Parana Technologies

USA . 1,064 parts In-Stock

1+ parts

$16.731

100+ parts

-

1k+ parts

$16.983

10k+ parts

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1,064

$16.731

-

$16.983

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DigiPath Technology Company

USA . 754 parts In-Stock

1+ parts

$18.423

100+ parts

$16.949

1k+ parts

-

10k+ parts

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754

$18.423

$16.949

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ChromeModa Solutions

Germany . 2,676 parts In-Stock

1+ parts

$18.799

100+ parts

$15.415

1k+ parts

-

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2,676

$18.799

$15.415

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IDEA Electronic Components Group

UK . 1,235 parts In-Stock

1+ parts

$18.799

100+ parts

$17.859

1k+ parts

$16.919

10k+ parts

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1,235

$18.799

$17.859

$16.919

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One Stop Electronics

USA . 1,399 parts In-Stock

1+ parts

$49.000

100+ parts

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1,399

$49.000

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Corphita

USA . 1,776 parts In-Stock

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1,776

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Overview

Discover the unmatched quality and reliability of the SN74LS444DW3 by Texas Instruments, a leading manufacturer in the industry. This versatile Other Function Logic IC offers endless possibilities for various applications, providing customers with exceptional value and performance. With its advanced technology and commercial-grade temperature range, this product guarantees seamless operation and efficiency. Trust Texas Instruments to deliver excellence with every component, making your projects stand out from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good protection to the internal components of the IC, ensuring durability and reliability.

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on circuit boards, saving space and reducing manufacturing costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a supply voltage of 5V makes this IC compatible with a wide range of digital circuits and systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand typical operating conditions without overheating.

Technology: TTL

TTL technology ensures compatibility with other TTL devices and offers reliable high-speed performance for digital logic applications.

Technical Specifications

Other Function Logic ICs SN74LS444DW3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS444DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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