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CD4048BNSRG4

Texas Instruments

CD4048BNSRG4 by Texas Instruments

CD4048BNSRG4 by Texas Instruments is a CMOS logic IC with 600ns propagation delay at 5V. It features 16 terminals, operates b/w -55 to 125 °C, and supports a supply voltage range of 3-18V. Ideal for applications requiring low power consumption and high noise immunity in military-grade environments.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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Digiode

USA . 3,414 parts In-Stock

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Native Components

USA . 472 parts In-Stock

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$2.003

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Northwest PG Solutions

USA . 479 parts In-Stock

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Parana Technologies

USA . 467 parts In-Stock

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$17.811

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One Stop Electronics

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AZTECH Wire

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DigiPath Technology Company

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$18.043

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ChromeModa Solutions

Germany . 2,747 parts In-Stock

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$16.410

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IDEA Electronic Components Group

UK . 1,777 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Overview

Unlock the power of innovation with Texas Instruments' CD4048BNSRG4, a cutting-edge Other Function Logic IC that boasts unparalleled quality and reliability. Perfect for a wide range of applications, this product offers customers exceptional value and benefits, including fast propagation delays and a wide operating temperature range. With Texas Instruments' reputation for excellence in technology, you can trust that the CD4048BNSRG4 will exceed your expectations. Experience the advantages of this top-of-the-line logic IC today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging material for the IC.

Propagation Delay At Nominal Supply: 600 ns

Fast propagation delay ensures efficient operation of the logic IC.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement compatible with most systems.

Load Capacitance (CL): 50 pF

Suitable for handling moderate capacitance loads.

Power Supplies (V): 5/15

Versatile power supply options provide flexibility in application.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments.

Output Characteristics: 3-STATE

3-state output allows the IC to be in high impedance state, providing flexibility in system design.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold conditions without issues.

Terminal Position: DUAL

Dual terminal position enhances stability and ease of connection.

Width: 5.3 mm

Compact width saves space on the PCB.

Temperature Grade: MILITARY

Suitable for use in rugged military applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals make soldering easier and more reliable.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and connection.

Maximum Supply Voltage (Vsup): 18 V

Can handle high supply voltages for robust performance.

Technical Specifications

Other Function Logic ICs CD4048BNSRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

600 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

CD4048BNSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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