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SN75430NP3

Texas Instruments

SN75430NP3 by Texas Instruments

SN75430NP3 by Texas Instruments is a 14-terminal logic IC with bipolar technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, with terminals in dual through-hole form at a pitch of 2.54mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,069 parts In-Stock

1+ parts

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6,069

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Digiode

USA . 2,603 parts In-Stock

1+ parts

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2,603

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$17.652

100+ parts

-

1k+ parts

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326

$17.652

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Parana Technologies

USA . 1,902 parts In-Stock

1+ parts

$29.845

100+ parts

-

1k+ parts

$63.956

10k+ parts

-

1,902

$29.845

-

$63.956

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DigiPath Technology Company

USA . 429 parts In-Stock

1+ parts

$32.863

100+ parts

$30.234

1k+ parts

-

10k+ parts

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429

$32.863

$30.234

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ChromeModa Solutions

Germany . 2,858 parts In-Stock

1+ parts

$33.534

100+ parts

$27.498

1k+ parts

-

10k+ parts

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2,858

$33.534

$27.498

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IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$33.534

100+ parts

$31.857

1k+ parts

$30.181

10k+ parts

-

969

$33.534

$31.857

$30.181

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One Stop Electronics

USA . 806 parts In-Stock

1+ parts

$57.000

100+ parts

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806

$57.000

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Corphita

USA . 4,223 parts In-Stock

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4,223

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Overview

Enhance your electronic designs with the SN75430NP3 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-quality products that exceed industry standards. The SN75430NP3 belongs to the category of Other Function Logic ICs, offering versatile applications in various electronic devices. With its durable plastic/epoxy package body and 14 terminals in an in-line style, this IC ensures reliable performance in temperatures ranging from 0 to 70°C. Trust Texas Instruments to provide innovative technology and superior products that bring value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide high durability and resistance to heat and chemicals, making this product suitable for various operating conditions.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards and ensures efficient use of space in electronic applications.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for different components and circuits, offering versatility in design and functionality.

Package Style (Meter): IN-LINE

The in-line package style enables simple installation and connection within electronic systems, facilitating seamless integration and maintenance.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand moderate levels of heat without compromising performance, ensuring reliability in diverse environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C allows this product to function effectively even in colder conditions, making it suitable for a wide range of applications.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connections, enhancing the product's reliability and enabling multiple wiring configurations.

Technology: BIPOLAR

Bipolar technology offers stable and precise logic operation, ensuring accurate signal processing and efficient performance in various logic functions.

Terminal Form: THROUGH-HOLE

Through-hole terminals make soldering and connection processes easier, simplifying assembly and maintenance tasks for the product.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for standard spacing between terminals, facilitating compatibility with common electronic components and circuit designs.

Technical Specifications

Other Function Logic ICs SN75430NP3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN75430NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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