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SN74LVC1G98QDBVRQ1

Texas Instruments

SN74LVC1G98QDBVRQ1 by Texas Instruments

SN74LVC1G98QDBVRQ1 by Texas Instruments is a CMOS logic IC with 7.3 ns propagation delay, 3-STATE output, and Schmitt Trigger feature. It operates at a supply voltage range of 1.65V to 5.5V and is ideal for automotive applications due to AEC-Q100 screening level. The small outline package with low profile design makes it suitable for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,290 parts In-Stock

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7,290

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Digiode

USA . 2,466 parts In-Stock

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2,466

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Distributors (Availability)

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$14.959

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789

$14.959

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Parana Technologies

USA . 447 parts In-Stock

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$27.520

100+ parts

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$36.880

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447

$27.520

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$36.880

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DigiPath Technology Company

USA . 1,372 parts In-Stock

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$30.303

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1,372

$30.303

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ChromeModa Solutions

Germany . 6,570 parts In-Stock

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$30.921

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$25.355

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6,570

$30.921

$25.355

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IDEA Electronic Components Group

UK . 892 parts In-Stock

1+ parts

$30.921

100+ parts

$29.375

1k+ parts

$27.829

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892

$30.921

$29.375

$27.829

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One Stop Electronics

USA . 780 parts In-Stock

1+ parts

$62.000

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780

$62.000

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Corphita

USA . 692 parts In-Stock

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692

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Microchip USA

USA . 478 parts In-Stock

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478

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Overview

Experience innovation at its finest with the SN74LVC1G98QDBVRQ1 by Texas Instruments. This cutting-edge Other Function Logic IC boasts high-quality materials and top-notch technology, perfect for automotive applications. With a fast propagation delay of just 7.3 ns, this small outline, low profile IC offers exceptional performance and reliability, making it the ideal choice for your next project. Discover the value and advantages that Texas Instruments brings to the table with this state-of-the-art component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the IC lightweight and cost-effective.

Propagation Delay At Nominal Supply: 7.3 ns

The low propagation delay ensures fast and efficient operation of the logic IC.

Surface Mount: YES

The surface mount capability allows for easy installation and integration into electronic circuit boards.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures the IC's reliability and durability in automotive applications.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V makes this IC suitable for power-efficient applications.

Power Supplies (V): 3.3

Operating at a supply voltage of 3.3V provides flexibility in power input options for various circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this IC can withstand harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for multiple outputs or high-impedance state, offering versatility in circuit design.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity in the IC.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power input options for a wide range of applications.

Technical Specifications

Other Function Logic ICs SN74LVC1G98QDBVRQ1 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G98QDBVRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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