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CD74HC670M96

Texas Instruments

CD74HC670M96 by Texas Instruments

CD74HC670M96 by Texas Instruments is a 4-bit logic IC with 42ns propagation delay at 4.5V. It features 3-STATE output and operates in temperatures ranging from -55 to 125°C. Suitable for military-grade applications, it comes in a small outline package with surface mount capability.

Median Price

$1.430

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 505 parts In-Stock

1+ parts

$1.580

100+ parts

-

1k+ parts

$1.190

10k+ parts

$1.000

505

$1.580

-

$1.190

$1.000

Rochester

USA . 6,360 parts In-Stock

1+ parts

-

100+ parts

$1.250

1k+ parts

$1.040

10k+ parts

$0.925

6,360

-

$1.250

$1.040

$0.925

DigiKey

USA . 6,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.560

10k+ parts

-

6,360

-

-

$1.560

-

Verical

USA . 6,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.300

10k+ parts

$1.156

6,360

-

-

$1.300

$1.156

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,825 parts In-Stock

1+ parts

$0.660

100+ parts

-

1k+ parts

-

10k+ parts

-

2,825

$0.660

-

-

-

Digiode

USA . 106 parts In-Stock

1+ parts

$0.694

100+ parts

-

1k+ parts

-

10k+ parts

-

106

$0.694

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 33,857 parts In-Stock

1+ parts

$0.640

100+ parts

$0.600

1k+ parts

$0.480

10k+ parts

$0.480

33,857

$0.640

$0.600

$0.480

$0.480

Corphita

USA . 3,592 parts In-Stock

1+ parts

$0.658

100+ parts

-

1k+ parts

-

10k+ parts

-

3,592

$0.658

-

-

-

Native Components

USA . 528 parts In-Stock

1+ parts

$1.710

100+ parts

-

1k+ parts

-

10k+ parts

-

528

$1.710

-

-

-

Northwest PG Solutions

USA . 447 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

447

$1.881

-

-

-

Parana Technologies

USA . 2,013 parts In-Stock

1+ parts

$25.613

100+ parts

-

1k+ parts

$26.226

10k+ parts

-

2,013

$25.613

-

$26.226

-

DigiPath Technology Company

USA . 741 parts In-Stock

1+ parts

$28.203

100+ parts

$25.947

1k+ parts

-

10k+ parts

-

741

$28.203

$25.947

-

-

ChromeModa Solutions

Germany . 3,251 parts In-Stock

1+ parts

$28.779

100+ parts

$23.599

1k+ parts

-

10k+ parts

-

3,251

$28.779

$23.599

-

-

IDEA Electronic Components Group

UK . 856 parts In-Stock

1+ parts

$28.779

100+ parts

$27.340

1k+ parts

$25.901

10k+ parts

-

856

$28.779

$27.340

$25.901

-

Microchip USA

USA . 3,795 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,795

-

-

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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100+ parts

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3,790

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 3,680 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,680

-

-

-

-

Perfect Parts

USA . 2,796 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,796

-

-

-

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Supply Digital

USA . 659 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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659

-

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-

Overview

Upgrade your electronic projects with the CD74HC670M96 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for all your logic IC needs. The CD74HC670M96 offers fast propagation delay and 3-state output characteristics, making it perfect for a wide range of applications. Whether you're working on industrial automation or consumer electronics, this versatile IC provides value and performance that exceed expectations. Trust Texas Instruments to bring cutting-edge technology to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 42 ns

Low propagation delay allows for fast signal processing, making this product suitable for time-critical applications.

Surface Mount: YES

Surface mounting capabilities make installation and assembly easier and more efficient.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a common voltage level of 4.5V, making it compatible with a wide range of systems and circuits.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in signal control, allowing for multiple signal states and improving overall system efficiency.

Temperature Grade: MILITARY

Designed to meet military-grade requirements for temperature range and reliability, ensuring consistent performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs CD74HC670M96 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HC670M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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