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SN74LVC1G97DBVR

Texas Instruments

SN74LVC1G97DBVR by Texas Instruments

SN74LVC1G97DBVR by Texas Instruments is a CMOS logic IC with 3 inputs, 9.3 ns propagation delay, and 16.4 ns tpd. It operates at 1.8V nominal voltage and supports load capacitance of 50 pF. Ideal for automotive applications due to its Schmitt Trigger feature and small outline package style.

Median Price

$0.126

Lifecycle Status

Suppliers In-Stock

34

In-Stock Inventory

1k+

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Texas Instruments

USA . 306,692 parts In-Stock

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DigiKey

USA . 32,408 parts In-Stock

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$0.230

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$0.090

Mouser Electronics

USA . 20,721 parts In-Stock

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$0.230

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$0.101

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20,721

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Newark

USA . 2,970 parts In-Stock

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$0.309

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Arrow

USA . 48,000 parts In-Stock

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Chip1Stop

Japan . 1,636 parts In-Stock

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Farnell

UK . 875 parts In-Stock

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Verical

USA . 511 parts In-Stock

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Distributors (In-Stock)

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Maritex

Poland . 3,480 parts In-Stock

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$0.117

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$0.086

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$0.066

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3,480

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Nova Conductors

Japan . 37 parts In-Stock

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Digiode

USA . 2,218 parts In-Stock

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TME

Poland . 64 parts In-Stock

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64

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Component Electronics Inc.

Canada . 766 parts In-Stock

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$1.150

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$0.870

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$0.750

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Forefront Electronics and Design

USA . 1 parts In-Stock

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Vyrian

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Chip Stock

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Component Sense

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Eagle Technology Solutions

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Bristol Electronics

USA . 3,000 parts In-Stock

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Dan-Mar Components

USA . 3,000 parts In-Stock

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PC Components Company LLC

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Elcom Components

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ACDS - Activité Composants Distribution Service

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Connector Distribution Corp

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QIE Inc.

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North Shore Components

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Speed Components Ltd

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Touchstone Systems

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ComSIT Distribution GmbH

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Prism Electronics

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Semicontronic

India . 52,621 parts In-Stock

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$0.071

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$0.069

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$0.069

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Ampacity Inc.

Singapore . 52,457 parts In-Stock

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Continental Prestige Electronics

USA . 3,338 parts In-Stock

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Argo Parts USA

USA . 3,329 parts In-Stock

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Corphita

USA . 3,720 parts In-Stock

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$0.145

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Microchip USA

USA . 2,272 parts In-Stock

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$0.707

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Parana Technologies

USA . 1,690 parts In-Stock

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$7.990

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$742.032

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$7.191

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DigiPath Technology Company

USA . 19 parts In-Stock

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$8.798

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$8.095

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ChromeModa Solutions

Germany . 2,277 parts In-Stock

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$8.978

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$7.362

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$8.978

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

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$8.978

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$8.529

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$8.080

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Corohmni

South Africa . 23 parts In-Stock

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Modulus Dynamics

Lithuania . 3,727 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$32.030

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Computer Components Inc. - USA

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XScomponents

USA . 2,000 parts In-Stock

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Robosynatics

Brazil . 1,420 parts In-Stock

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Lucentia Tech

USA . 1,420 parts In-Stock

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$29.283

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Cyclops Electronics Ltd (Excess)

UK . 1,128 parts In-Stock

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Glotronic Ltd.

UK . 902 parts In-Stock

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GreenTree Electronics

Israel . 527 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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Overview

Unlock the power of innovation with the SN74LVC1G97DBVR by Texas Instruments. Designed with precision and excellence, this Other Function Logic IC offers unparalleled performance in a compact package. Ideal for automotive applications, this CMOS technology-based IC delivers reliable results with a low propagation delay of 9.3 ns. With a wide operating temperature range from -40 to 125°C, this IC ensures durability and functionality even in extreme conditions. Trust Texas Instruments to provide top-of-the-line quality, value, and performance with the SN74LVC1G97DBVR. Elevate your projects with this versatile and efficient logic IC today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the IC, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9.3 ns

Low propagation delay ensures quick signal processing and response times, making this IC efficient for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage of 1.8V, making it energy-efficient and suitable for battery-operated devices.

No. of Inputs: 3

Three inputs provide flexibility for input signals, allowing for versatile logic operations and functions.

Output Characteristics: 3-STATE

3-STATE output allows the IC to provide high impedance output, giving control over the output signal and enhancing signal integrity in multi-device configurations.

Technology: CMOS

CMOS technology offers high noise immunity, low power consumption, and compatibility with a wide range of voltage levels, making the IC reliable and versatile.

Technical Specifications

Other Function Logic ICs SN74LVC1G97DBVR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

9.3 ns

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.6 mm

Trade Compliance

SN74LVC1G97DBVR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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