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NB7L86MMN

Onsemi

NB7L86MMN by Onsemi

NB7L86MMN by Onsemi is a high-speed logic IC with a propagation delay of 0.18 ns, suitable for industrial applications. Operating at a supply voltage of 2.5V, it features 16 terminals in a square package shape and supports surface mount technology. With ECL technology and a max operating temperature of 85 °C, this chip carrier is ideal for applications requiring fast signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,479 parts In-Stock

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Digiode

USA . 2,291 parts In-Stock

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First Choice Components Inc.

USA . 3 parts In-Stock

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AZTECH Wire

Italy . 282 parts In-Stock

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$10.540

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Component Stockers USA

USA . 663 parts In-Stock

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$99.990

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663

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SupplyDigital Components

Austria . 8,254 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,204 parts In-Stock

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Problanco Electronics

Mexico . 3,472 parts In-Stock

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Corphita

USA . 1,349 parts In-Stock

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TANS Electronics

Latvia . 982 parts In-Stock

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Kulean Microsystems

USA . 432 parts In-Stock

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Microchip USA

USA . 369 parts In-Stock

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Corohmni

South Africa . 290 parts In-Stock

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UHIMA Technologies

Türkiye . 153 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the NB7L86MMN by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers cutting-edge technology in the category of Other Function Logic ICs. This high-quality product offers lightning-fast propagation delay, making it perfect for a variety of applications. With a nominal supply voltage of 2.5V and a maximum operating temperature of 85 °C, the NB7L86MMN provides exceptional value and benefits to customers seeking top-notch solutions. Upgrade your electronics with this premium chip carrier and experience the advantages firsthand.

Feature Benefit Bullets

Propagation Delay at Nominal Supply: 0.18 ns

Ultra-low propagation delay ensures fast response times in logic operations.

Surface Mount: Yes

Easily mountable on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 2.5V

Works efficiently at a standard voltage level, ensuring compatibility with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold conditions, providing versatility in usage environments.

Technical Specifications

Other Function Logic ICs NB7L86MMN attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

7L

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB7L86MMN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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