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NB7L86MMNR2

Onsemi

NB7L86MMNR2 by Onsemi

NB7L86MMNR2 by Onsemi is a high-speed logic IC with a propagation delay of 0.18 ns, suitable for industrial applications. Operating at a nominal voltage of 2.5V, it features 16 terminals in a square package shape and supports surface mount technology. With a wide temperature range from -40 to 85 °C, this ECL technology chip carrier is ideal for applications requiring fast signal processing and low power consumption.

Median Price

$19.272

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$19.272

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Vyrian

USA . 8,028 parts In-Stock

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Digiode

USA . 951 parts In-Stock

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AZTECH Wire

Italy . 367 parts In-Stock

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$10.140

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Component Stockers USA

USA . 383 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 12,020 parts In-Stock

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SupplyDigital Components

Austria . 5,586 parts In-Stock

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Microchip USA

USA . 5,217 parts In-Stock

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Problanco Electronics

Mexico . 3,601 parts In-Stock

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TANS Electronics

Latvia . 3,209 parts In-Stock

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Kulean Microsystems

USA . 1,543 parts In-Stock

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Corphita

USA . 969 parts In-Stock

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Corohmni

South Africa . 442 parts In-Stock

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UHIMA Technologies

Türkiye . 261 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the NB7L86MMNR2 by Onsemi. As a leading manufacturer in the industry, Onsemi brings you cutting-edge technology with a wide range of applications in the category of Other Function Logic ICs. With a fast propagation delay and a nominal supply voltage of 2.5V, this product offers exceptional performance and efficiency. Experience the benefits of surface mount compatibility, compact package shape, and a wide operating temperature range. Elevate your projects with the value and advantages that only Onsemi can provide.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.18 ns

This low propagation delay ensures quick response times, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and secure placement on circuit boards, saving space and enabling automated assembly processes.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage of 2.5V, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand challenging environmental conditions in industrial applications.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed performance and low power consumption, making this product ideal for demanding logic applications.

Technical Specifications

Other Function Logic ICs NB7L86MMNR2 attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

7L

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.18 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB7L86MMNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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