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SNJ55326W

Texas Instruments

SNJ55326W by Texas Instruments

SNJ55326W by Texas Instruments is a MILITARY-grade TTL logic IC with 16 terminals in a FLATPACK package. Operating temperature range from -55°C to 125°C, suitable for harsh environments. Ideal for applications requiring high reliability and performance in military and aerospace industries.

Median Price

$12.500

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,307 parts In-Stock

1+ parts

-

100+ parts

$10.000

1k+ parts

$8.950

10k+ parts

$8.420

4,307

-

$10.000

$8.950

$8.420

DigiKey

USA . 4,307 parts In-Stock

1+ parts

-

100+ parts

$13.160

1k+ parts

-

10k+ parts

-

4,307

-

$13.160

-

-

Verical

USA . 2,894 parts In-Stock

1+ parts

-

100+ parts

$12.500

1k+ parts

$11.188

10k+ parts

$10.525

2,894

-

$12.500

$11.188

$10.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,938 parts In-Stock

1+ parts

$10.564

100+ parts

-

1k+ parts

-

10k+ parts

-

3,938

$10.564

-

-

-

Vyrian

USA . 2,832 parts In-Stock

1+ parts

$11.120

100+ parts

-

1k+ parts

-

10k+ parts

-

2,832

$11.120

-

-

-

Manoshevitz Elec. Sales

Israel . 281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

281

-

-

-

-

Electronic Expediters

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,480 parts In-Stock

1+ parts

$10.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,480

$10.008

-

-

-

Component Stockers USA

USA . 4,068 parts In-Stock

1+ parts

$11.220

100+ parts

$10.550

1k+ parts

$9.540

10k+ parts

-

4,068

$11.220

$10.550

$9.540

-

Parana Technologies

USA . 963 parts In-Stock

1+ parts

$12.822

100+ parts

-

1k+ parts

$13.292

10k+ parts

-

963

$12.822

-

$13.292

-

DigiPath Technology Company

USA . 278 parts In-Stock

1+ parts

$14.119

100+ parts

-

1k+ parts

-

10k+ parts

-

278

$14.119

-

-

-

IDEA Electronic Components Group

UK . 688 parts In-Stock

1+ parts

$14.407

100+ parts

$13.687

1k+ parts

$12.966

10k+ parts

-

688

$14.407

$13.687

$12.966

-

ChromeModa Solutions

Germany . 104 parts In-Stock

1+ parts

$14.407

100+ parts

$11.814

1k+ parts

-

10k+ parts

-

104

$14.407

$11.814

-

-

Overview

Unleash the power of cutting-edge technology with the SNJ55326W by Texas Instruments. Manufactured with precision and expertise, this high-quality logic IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product is designed to exceed expectations and deliver exceptional value to customers. Experience the advantages of seamless operation, superior efficiency, and advanced functionality with the SNJ55326W. Elevate your projects to new heights with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity, making them suitable for high temperature environments and improving overall reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing overall production costs.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures that the product meets stringent quality and reliability standards, making it suitable for mission-critical applications.

Package Shape: RECTANGULAR

Rectangular packages are commonly used in electronic devices, providing a compact form factor for efficient PCB layout.

No. of Terminals: 16

With 16 terminals, this product can support a variety of input and output connections, making it versatile for different applications.

Package Style (Meter): FLATPACK

Flatpack packages offer a low profile design, ideal for applications where space is limited and height restrictions are a concern.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in demanding environments without risk of overheating.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation in cold climates or environments where temperature fluctuations occur.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design and layout, allowing for easy integration into existing systems.

Temperature Grade: MILITARY

Military-grade components undergo rigorous testing and screening processes, ensuring optimal performance and durability in harsh operating conditions.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it suitable for applications where performance and efficiency are key.

Terminal Form: FLAT

Flat terminal forms are easy to solder and provide a secure connection, ensuring reliable electrical contact for stable operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close spacing of terminals, enabling high-density PCB designs and compact electronic devices.

Technical Specifications

Other Function Logic ICs SNJ55326W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55326W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-085-6675, 5962010856675

NIIN

010856675

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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