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NL7SZ57MU1TCG

Onsemi

NL7SZ57MU1TCG by Onsemi

NL7SZ57MU1TCG by Onsemi is a CMOS logic IC with 6 terminals, operating b/w -55 to 125 °C. It has a supply voltage range of 1.65V to 5.5V and comes in a small outline package suitable for military-grade applications. This surface-mount IC is ideal for compact electronic devices requiring high-temperature resilience and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,236 parts In-Stock

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Digiode

USA . 124 parts In-Stock

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TANS Electronics

Latvia . 6,938 parts In-Stock

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Kulean Microsystems

USA . 4,839 parts In-Stock

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Corphita

USA . 2,295 parts In-Stock

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Problanco Electronics

Mexico . 1,879 parts In-Stock

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SupplyDigital Components

Austria . 1,763 parts In-Stock

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UHIMA Technologies

Türkiye . 773 parts In-Stock

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Corohmni

South Africa . 360 parts In-Stock

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Overview

Upgrade your electronics with the NL7SZ57MU1TCG by Onsemi, a top-quality Other Function Logic IC that offers unmatched performance and reliability. Created by the renowned manufacturer Onsemi, this product is designed to meet the highest industry standards for excellence. Ideal for a wide range of applications, this IC provides customers with exceptional value, benefits, and advantages. Experience the difference with the NL7SZ57MU1TCG and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability of the package, making it suitable for long-term usage.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape saves space on the PCB and allows for efficient layout planning.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of applications.

No. of Terminals: 6

Having 6 terminals provides flexibility in connectivity options and functionality.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and thin profile design save space on the PCB and allow for compact circuit designs.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Capable of operating at low temperatures, ensuring functionality in various conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity.

Maximum Seated Height: 0.55 mm

Low seated height allows for compact placement on the PCB, minimizing overall board height.

Width: 1 mm

Narrow width enables efficient use of PCB space and allows for dense component placement.

Minimum Supply Voltage (Vsup): 1.65 V

Operates at low supply voltage, suitable for battery-powered or low-power applications.

Length: 1.45 mm

Compact length saves space on the PCB and enables compact circuit designs.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and durability in harsh environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it suitable for various applications.

Terminal Form: NO LEAD

No-lead terminals are environmentally friendly and offer better thermal performance.

Packing Method: TR

TR (tape and reel) packing method is suitable for automated assembly processes, improving efficiency and accuracy.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB, saving space and enabling compact designs.

Maximum Supply Voltage (Vsup): 5.5 V

Operates at a high supply voltage, providing flexibility for a wide range of applications.

Technical Specifications

Other Function Logic ICs NL7SZ57MU1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NL7SZ57MU1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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