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CD74ACT297ME4

Texas Instruments

CD74ACT297ME4 by Texas Instruments

CD74ACT297ME4 by Texas Instruments is a CMOS logic IC with 16 terminals, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and peak reflow temperature of 260°C. This small outline package is suitable for military-grade applications requiring high-temperature resistance and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,161 parts In-Stock

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Digiode

USA . 2,040 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 405 parts In-Stock

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$0.149

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$0.143

405

$0.149

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$0.143

Northwest PG Solutions

USA . 2,055 parts In-Stock

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$0.164

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$0.145

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$0.164

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$0.145

Parana Technologies

USA . 2,328 parts In-Stock

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$14.150

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$14.611

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$14.150

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$14.611

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ChromeModa Solutions

Germany . 2,955 parts In-Stock

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$15.899

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$13.037

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$15.899

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IDEA Electronic Components Group

UK . 1,363 parts In-Stock

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$15.899

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$15.104

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$14.309

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1,363

$15.899

$15.104

$14.309

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AZTECH Wire

Italy . 450 parts In-Stock

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$16.695

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$16.695

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One Stop Electronics

USA . 299 parts In-Stock

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$27.000

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Corphita

USA . 4,078 parts In-Stock

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DigiPath Technology Company

USA . 739 parts In-Stock

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$14.335

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Overview

Elevate your electronic designs with the Texas Instruments CD74ACT297ME4, a top-tier Other Function Logic IC that guarantees superior quality and reliability. Manufactured by industry leader Texas Instruments, this product offers unparalleled performance and precision for a wide range of applications. With its compact design and advanced technology, this IC ensures optimal functionality while maintaining a high level of efficiency. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights. Choose the CD74ACT297ME4 for unbeatable value, benefits, and advantages that will set your designs apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the internal components.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding operational environments.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Other Function Logic ICs CD74ACT297ME4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74ACT297ME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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