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SNJ54LS629FK

Texas Instruments

SNJ54LS629FK by Texas Instruments

SNJ54LS629FK by Texas Instruments is a TTL logic IC with 2 functions, 15ns propagation delay, and 5V nominal voltage. It is used in military-grade applications requiring fast signal processing and operates within a temperature range of -55 to 125°C. The chip carrier package style makes it suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 561 parts In-Stock

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Digiode

USA . 454 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 137 parts In-Stock

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$14.172

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$14.629

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137

$14.172

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$14.629

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DigiPath Technology Company

USA . 254 parts In-Stock

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$15.606

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$14.357

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ChromeModa Solutions

Germany . 2,407 parts In-Stock

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$15.924

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$13.058

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$15.924

$13.058

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IDEA Electronic Components Group

UK . 664 parts In-Stock

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$15.924

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$15.128

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$14.332

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664

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$14.332

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One Stop Electronics

USA . 251 parts In-Stock

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$16.000

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AZTECH Wire

Italy . 214 parts In-Stock

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$19.814

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Corphita

USA . 4,936 parts In-Stock

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Microchip USA

USA . 1,946 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments SNJ54LS629FK. Crafted with precision and expertise, this high-quality logic IC offers unparalleled performance and reliability for a wide range of applications. From military-grade operations to industrial automation, this versatile chip delivers lightning-fast processing speeds and efficient functionality. Say goodbye to compromise and hello to top-tier performance with Texas Instruments' innovative SNJ54LS629FK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability of the product, making it suitable for harsh environments.

Propagation Delay At Nominal Supply: 15 ns

Low propagation delay ensures fast signal processing, making this product ideal for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 2

Having multiple functions in one IC increases versatility and efficiency in circuit design.

Package Shape: SQUARE

Square package shape offers uniformity and ease of handling during installation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems.

No. of Terminals: 20

Having a high number of terminals allows for complex connectivity and functionality within a single component.

Maximum I (ol): 24 Amp

High output current capability makes this IC suitable for driving power-hungry loads.

Minimum Supply Voltage (Vsup): 4.75 V

Supporting a low minimum supply voltage enables operation in systems with tight power constraints.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable performance in extreme temperature conditions.

Technical Specifications

Other Function Logic ICs SNJ54LS629FK attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54LS629FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-231-3802, 5962012313802

NIIN

012313802

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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