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SNJ54ALVTH16260WD

Texas Instruments

SNJ54ALVTH16260WD by Texas Instruments

SNJ54ALVTH16260WD by Texas Instruments is a BICMOS technology IC with 56 terminals, operating b/w -55°C to 125°C. It has power supplies of 2.5/3.3V and is MILITARY grade screened for reliability. This RECTANGULAR FLATPACK package is ideal for applications requiring high temperature tolerance and robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,094 parts In-Stock

1+ parts

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8,094

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Digiode

USA . 3,531 parts In-Stock

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3,531

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Distributors (Availability)

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AZTECH Wire

Italy . 190 parts In-Stock

1+ parts

$14.378

100+ parts

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190

$14.378

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Parana Technologies

USA . 2,170 parts In-Stock

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$19.215

100+ parts

-

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$19.258

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2,170

$19.215

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$19.258

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ChromeModa Solutions

Germany . 1,589 parts In-Stock

1+ parts

$21.590

100+ parts

$17.704

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1,589

$21.590

$17.704

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IDEA Electronic Components Group

UK . 550 parts In-Stock

1+ parts

$21.590

100+ parts

$20.510

1k+ parts

$19.431

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550

$21.590

$20.510

$19.431

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One Stop Electronics

USA . 956 parts In-Stock

1+ parts

$36.000

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956

$36.000

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Corphita

USA . 4,608 parts In-Stock

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4,608

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DigiPath Technology Company

USA . 1,944 parts In-Stock

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$19.466

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1,944

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$19.466

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Overview

Elevate your electronic designs with the reliable and high-quality SNJ54ALVTH16260WD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch components like this Other Function Logic IC with precision and innovation. Perfect for a wide range of applications, this product offers exceptional value to customers seeking efficient performance and durability in their projects. Explore the endless possibilities and benefits that the SNJ54ALVTH16260WD can bring to your creations today!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic provides excellent thermal conductivity and mechanical stability, making it ideal for high temperature and rugged environments.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and space-saving designs.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure reliability and performance in demanding military applications.

Power Supplies (V): 2.5/3.3

Offers compatibility with common power supply voltages, increasing versatility for various applications.

No. of Terminals: 56

Higher number of terminals allow for more connectivity and functionality in the circuit design.

Package Style (Meter): FLATPACK

Flatpack design saves space and enables efficient heat dissipation in compact electronic systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance in harsh environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range allows for operation in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity in the circuit.

Temperature Grade: MILITARY

Designed to meet stringent military standards for reliability, durability, and performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption.

Terminal Form: FLAT

Flat terminal form simplifies PCB layout and enhances soldering reliability.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting and miniaturization of electronic devices.

Technical Specifications

Other Function Logic ICs SNJ54ALVTH16260WD attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F56

No. of Terminals:

56

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL56,.4,25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SNJ54ALVTH16260WD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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