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NBSG86AMNR2

Onsemi

NBSG86AMNR2 by Onsemi

NBSG86AMNR2 by Onsemi is a high-speed logic IC with a propagation delay of 0.22 ns, suitable for industrial applications. It operates at a nominal voltage of 2.5V and has a max power supply current of 39mA. This surface-mount chip carrier package features ECL technology and can withstand temperatures from -40 to 85 °C.

Median Price

$31.522

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$28.020

1k+ parts

$25.070

10k+ parts

$23.590

31

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$28.020

$25.070

$23.590

Verical

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$35.025

1k+ parts

$31.337

10k+ parts

$29.488

31

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$35.025

$31.337

$29.488

Distributors (In-Stock)

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Vyrian

USA . 8,773 parts In-Stock

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8,773

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Chip Stock

USA . 3,210 parts In-Stock

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Digiode

USA . 2,084 parts In-Stock

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2,084

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Distributors (Availability)

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AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$10.120

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-

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385

$10.120

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$21.518

100+ parts

$19.581

1k+ parts

$17.645

10k+ parts

-

1,000

$21.518

$19.581

$17.645

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Corohmni

South Africa . 203 parts In-Stock

1+ parts

$27.530

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203

$27.530

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Microchip USA

USA . 325 parts In-Stock

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$68.908

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325

$68.908

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TANS Electronics

Latvia . 5,980 parts In-Stock

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5,980

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Problanco Electronics

Mexico . 5,880 parts In-Stock

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Kulean Microsystems

USA . 5,870 parts In-Stock

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SupplyDigital Components

Austria . 3,785 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

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1,800

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Corphita

USA . 708 parts In-Stock

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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Continental Prestige Electronics

USA . 76 parts In-Stock

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Perfect Parts

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Overview

Discover the NBSG86AMNR2 by Onsemi, a top-quality Other Function Logic IC that delivers lightning-fast propagation delay at just 0.22 ns. Designed for a variety of applications, this Surface Mount chip features a SQUARE package shape and an INDUSTRIAL temperature grade. With a nominal supply voltage of 2.5V and power supplies ranging from +-2.5 to +-3.3V, this product offers exceptional performance in a compact form factor. Trust Onsemi's expertise in semiconductor manufacturing and unlock the value and benefits this innovative IC brings to your projects. Elevate your designs with the NBSG86AMNR2 today!

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.22 ns

This extremely low propagation delay ensures fast and efficient operation of the logic IC.

Nominal Supply Voltage / Vsup (V): 2.5

The stable supply voltage of 2.5V allows for consistent performance of the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is suitable for industrial environments with varying temperature conditions.

Technology: ECL

ECL technology offers high-speed performance making this IC ideal for applications requiring quick response times.

Terminal Finish: TIN LEAD

The TIN LEAD terminal finish provides reliable soldering connections for secure installation and operation.

Technical Specifications

Other Function Logic ICs NBSG86AMNR2 attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

.22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NBSG86AMNR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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