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SN74LS440FN3

Texas Instruments

SN74LS440FN3 by Texas Instruments

SN74LS440FN3 by Texas Instruments is a TTL technology logic IC with 20 terminals in a square chip carrier package. It operates at temperatures b/w 0°C to 70°C, with a nominal voltage of 5V. This IC is commonly used in commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,674 parts In-Stock

1+ parts

-

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5,674

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Digiode

USA . 1,825 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,825

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 268 parts In-Stock

1+ parts

$8.188

100+ parts

-

1k+ parts

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10k+ parts

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268

$8.188

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One Stop Electronics

USA . 205 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

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205

$22.000

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Parana Technologies

USA . 1,169 parts In-Stock

1+ parts

$24.420

100+ parts

$2,267.751

1k+ parts

$21.978

10k+ parts

-

1,169

$24.420

$2,267.751

$21.978

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DigiPath Technology Company

USA . 1,343 parts In-Stock

1+ parts

$26.889

100+ parts

-

1k+ parts

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10k+ parts

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1,343

$26.889

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IDEA Electronic Components Group

UK . 1,995 parts In-Stock

1+ parts

$27.438

100+ parts

$26.066

1k+ parts

$24.694

10k+ parts

-

1,995

$27.438

$26.066

$24.694

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ChromeModa Solutions

Germany . 1,707 parts In-Stock

1+ parts

$27.438

100+ parts

$22.499

1k+ parts

-

10k+ parts

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1,707

$27.438

$22.499

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Corphita

USA . 3,239 parts In-Stock

1+ parts

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3,239

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Overview

Enhance your electronic designs with the SN74LS440FN3 by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments delivers reliable products like this one in the Other Function Logic ICs category. This versatile chip offers countless applications and is perfect for a wide range of projects. With a nominal supply voltage of 5V and a temperature grade of COMMERCIAL, this chip ensures optimal performance in various environments. Trust Texas Instruments to provide you with high-quality components that deliver value, benefits, and advantages to meet all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes the product easier to install and reduces space requirements on the PCB, making it suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 5

The product operates at a standard nominal supply voltage of 5V, which is commonly used in many electronic systems, ensuring compatibility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can function reliably even under moderate to high temperature conditions.

Technology: TTL

The use of TTL technology ensures fast response times and low power consumption, making the product suitable for high-speed applications.

Technical Specifications

Other Function Logic ICs SN74LS440FN3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS440FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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