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SN74LS440DW3

Texas Instruments

SN74LS440DW3 by Texas Instruments

SN74LS440DW3 by Texas Instruments is a TTL technology logic IC with 20 terminals and a supply voltage of 5V. It operates b/w 0-70°C, suitable for commercial applications. This surface-mount IC in a small outline package is commonly used in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,961 parts In-Stock

1+ parts

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4,961

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Vyrian

USA . 1,945 parts In-Stock

1+ parts

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1,945

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 599 parts In-Stock

1+ parts

$11.909

100+ parts

-

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-

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599

$11.909

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Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$24.425

100+ parts

-

1k+ parts

$25.096

10k+ parts

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1,374

$24.425

-

$25.096

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DigiPath Technology Company

USA . 688 parts In-Stock

1+ parts

$26.895

100+ parts

-

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688

$26.895

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ChromeModa Solutions

Germany . 5,721 parts In-Stock

1+ parts

$27.444

100+ parts

$22.504

1k+ parts

-

10k+ parts

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5,721

$27.444

$22.504

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IDEA Electronic Components Group

UK . 2,122 parts In-Stock

1+ parts

$27.444

100+ parts

$26.072

1k+ parts

$24.700

10k+ parts

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2,122

$27.444

$26.072

$24.700

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One Stop Electronics

USA . 1,453 parts In-Stock

1+ parts

$34.000

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1,453

$34.000

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Corphita

USA . 2,167 parts In-Stock

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2,167

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Overview

The Texas Instruments SN74LS440DW3 is a top-quality Other Function Logic IC that offers unparalleled performance and reliability. Designed with precision by a leading manufacturer in the industry, this product is perfect for a wide range of applications. With its innovative design and advanced technology, customers can expect outstanding value and benefits. Trust Texas Instruments to deliver excellence in every component, bringing you the advantages you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good flexibility and durability, making the product resistant to damage during handling and operation.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular shape enables efficient use of space on the circuit board, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage simplifies integration with other components and power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably function in a variety of environmental conditions without overheating.

Technology: TTL

Utilizing TTL technology ensures high-speed performance and compatibility with other TTL logic devices.

Technical Specifications

Other Function Logic ICs SN74LS440DW3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS440DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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