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74AUP1G58FHX

Onsemi

74AUP1G58FHX by Onsemi

74AUP1G58FHX by Onsemi is a CMOS logic IC with Schmitt Trigger feature. It operates at 1.2V nominal voltage, offering a propagation delay of 19ns. Suitable for industrial applications, it has a max operating temperature of 85°C and comes in a small outline package with surface mount capability.

Median Price

$0.151

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 490,000 parts In-Stock

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$0.130

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$0.130

Flip Electronics (Authorized)

USA . 490,000 parts In-Stock

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Farnell

UK . 348,053 parts In-Stock

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$0.254

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$0.254

Arrow

USA . 10,000 parts In-Stock

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$0.133

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$0.133

Mouser Electronics

USA . 2,479 parts In-Stock

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$0.169

2,479

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$0.169

Distributors (In-Stock)

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Vyrian

USA . 2,214 parts In-Stock

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$0.146

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$0.146

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Flip Electronics

USA . 490,000 parts In-Stock

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490,000

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DigiKey Marketplace

USA . 200,000 parts In-Stock

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Inventory MP

USA . 3,734 parts In-Stock

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Bristol Electronics

USA . 3,734 parts In-Stock

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Digiode

USA . 1,411 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 405 parts In-Stock

1+ parts

$0.146

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405

$0.146

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Northwest PG Solutions

USA . 2,031 parts In-Stock

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$2.589

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2,031

$2.589

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Continental Prestige Electronics

USA . 632,703 parts In-Stock

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$0.201

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$0.201

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Problanco Electronics

Mexico . 6,072 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,222 parts In-Stock

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Robosynatics

Brazil . 5,000 parts In-Stock

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$18.521

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$17.150

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$17.150

5,000

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$18.521

$17.150

$17.150

Lucentia Tech

USA . 5,000 parts In-Stock

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$18.521

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$17.150

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$17.150

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$18.521

$17.150

$17.150

Kepictronics

USA . 4,200 parts In-Stock

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Microchip USA

USA . 3,619 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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TANS Electronics

Latvia . 2,006 parts In-Stock

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Corphita

USA . 1,847 parts In-Stock

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Kulean Microsystems

USA . 1,259 parts In-Stock

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Supply Digital

USA . 908 parts In-Stock

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SupplyDigital Components

Austria . 864 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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Native Components

USA . 139 parts In-Stock

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$2.283

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139

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Overview

Unlock the power of precision with the 74AUP1G58FHX by Onsemi. Expertly manufactured with top-quality materials, this Other Function Logic IC boasts a quick propagation delay and a wide range of applications. From industrial automation to consumer electronics, this versatile component offers unparalleled performance at a nominal supply voltage of 1.2V. With a compact design and reliable surface mount capabilities, customers can trust in the value and benefits of this cutting-edge product. Elevate your projects with the 74AUP1G58FHX and experience seamless integration and superior functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product's longevity and performance.

Propagation Delay At Nominal Supply: 19 ns

Low propagation delay ensures fast response time, making this product suitable for applications requiring quick signal processing.

Surface Mount: YES

Surface mount capability makes installation and assembly easier and more efficient.

Nominal Supply Voltage (Vsup): 1.2 V

Operates at a low voltage, making it energy-efficient and suitable for low-power applications.

Maximum I (ol): 1.1 Amp

Can handle higher current loads, providing flexibility in various circuit designs.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

Operates reliably even in very low temperatures, making it versatile for different environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making the product efficient and reliable.

Technical Specifications

Other Function Logic ICs 74AUP1G58FHX attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74AUP1G58FHX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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