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SN74AUP1G58DBVRG4

Texas Instruments

SN74AUP1G58DBVRG4 by Texas Instruments

SN74AUP1G58DBVRG4 by Texas Instruments is a CMOS logic IC with 26.6ns propagation delay, 30pF load capacitance, and 1.7A max I (ol). It is ideal for industrial applications requiring a small outline package with Schmitt Trigger functionality and a wide operating temperature range from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,485 parts In-Stock

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2,485

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Digiode

USA . 1,462 parts In-Stock

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1,462

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Distributors (Availability)

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One Stop Electronics

USA . 1,109 parts In-Stock

1+ parts

$5.000

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1,109

$5.000

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AZTECH Wire

Italy . 727 parts In-Stock

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$15.252

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727

$15.252

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Parana Technologies

USA . 646 parts In-Stock

1+ parts

$17.683

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$17.871

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646

$17.683

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$17.871

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ChromeModa Solutions

Germany . 6,931 parts In-Stock

1+ parts

$19.868

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$16.292

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6,931

$19.868

$16.292

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IDEA Electronic Components Group

UK . 119 parts In-Stock

1+ parts

$19.868

100+ parts

$18.875

1k+ parts

$17.881

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119

$19.868

$18.875

$17.881

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Corphita

USA . 2,375 parts In-Stock

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2,375

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DigiPath Technology Company

USA . 743 parts In-Stock

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$17.913

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743

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$17.913

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Overview

Unlock the power of innovation with the SN74AUP1G58DBVRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Other Function Logic ICs that are versatile and reliable. This compact and efficient IC is perfect for a wide range of applications, offering customers unmatched value and performance. Experience faster speeds, lower power consumption, and seamless integration with the SN74AUP1G58DBVRG4. Upgrade your electronics with this cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 26.6 ns

The low propagation delay ensures fast and efficient operation of the logic IC, making it suitable for high-speed applications.

Surface Mount: YES

The surface mount capability simplifies the installation process and allows for easy integration into electronic circuits.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V ensures efficient power consumption and compatibility with a wide range of systems.

Load Capacitance (CL): 30 pF

The low load capacitance of 30pF ensures stable and reliable performance of the IC in various circuit configurations.

Power Supplies (V): 1.2/3.3

The support for multiple power supply voltages (1.2V and 3.3V) provides flexibility in design and compatibility with different systems.

No. of Terminals: 6

The 6 terminals offer sufficient connectivity options for interfacing with other components and peripherals in the circuit.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style allows for compact and space-saving designs in electronic PCBs.

Maximum I (ol): 1.7 Amp

The high maximum output current of 1.7A ensures robust and reliable performance of the IC in driving external loads.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in harsh environmental conditions.

Technical Specifications

Other Function Logic ICs SN74AUP1G58DBVRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74AUP1G58DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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