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SN74LS627FN

Texas Instruments

SN74LS627FN by Texas Instruments

SN74LS627FN by Texas Instruments is a TTL logic IC with 20 terminals in a square chip carrier package. It operates b/w 0-70°C and has a supply voltage range of 4.75-5.25V, making it suitable for commercial applications requiring precise digital signal processing. The surface-mount design and J-bend terminals enhance its versatility in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,932 parts In-Stock

1+ parts

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7,932

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Digiode

USA . 2,888 parts In-Stock

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2,888

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Electronic Expediters

USA . 192 parts In-Stock

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192

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 282 parts In-Stock

1+ parts

$8.716

100+ parts

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282

$8.716

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Parana Technologies

USA . 1,382 parts In-Stock

1+ parts

$18.030

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$18.182

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1,382

$18.030

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$18.182

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DigiPath Technology Company

USA . 1,171 parts In-Stock

1+ parts

$19.853

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1,171

$19.853

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ChromeModa Solutions

Germany . 4,192 parts In-Stock

1+ parts

$20.258

100+ parts

$16.612

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4,192

$20.258

$16.612

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IDEA Electronic Components Group

UK . 112 parts In-Stock

1+ parts

$20.258

100+ parts

$19.245

1k+ parts

$18.232

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112

$20.258

$19.245

$18.232

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One Stop Electronics

USA . 892 parts In-Stock

1+ parts

$44.000

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892

$44.000

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Corphita

USA . 679 parts In-Stock

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679

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Overview

Enhance your electronic projects with the SN74LS627FN by Texas Instruments, a top-quality Other Function Logic IC that offers unmatched reliability and performance. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this chip will meet all your needs. Ideal for a wide range of applications, this IC provides exceptional value and benefits, ensuring seamless operation and efficiency in your designs. Upgrade your projects today with the SN74LS627FN and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is known for its durability and resistance to heat and moisture, making this product suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape helps in optimizing space on the circuit board and allows for a more compact design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration simpler.

No. of Terminals: 20

With 20 terminals, this product offers versatility in connections and can support complex circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides efficient heat dissipation and protection for the integrated circuits, enhancing reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows this product to function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures this product can be used in a variety of temperature-controlled applications.

Terminal Position: QUAD

The terminal position in a quad configuration provides increased stability and ease of connection within the circuit.

Minimum Supply Voltage (Vsup): 4.75 V

The minimum supply voltage requirement of 4.75V ensures reliable operation and prevents under-voltage issues in the circuit.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades means this product is suitable for standard industrial and commercial applications.

Technology: TTL

Using TTL technology ensures high-speed performance and compatibility with other TTL-based components in the circuit.

Terminal Form: J BEND

The J Bend terminal form simplifies the soldering process and provides secure connections for long-term reliability.

Maximum Supply Voltage (Vsup): 5.25 V

The maximum supply voltage tolerance of 5.25V protects the product from over-voltage conditions, enhancing its durability.

Technical Specifications

Other Function Logic ICs SN74LS627FN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

S-PQCC-J20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74LS627FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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