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SN55325W

Texas Instruments

SN55325W by Texas Instruments

Texas Instruments SN55325W is a MILITARY-grade BIPOLAR IC with 16 terminals, operating from -55 to 125 °C. It has dual terminal position, RECTANGULAR CERAMIC package, and supports 5V and 24V power supplies. Ideal for applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,257 parts In-Stock

1+ parts

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3,257

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Digiode

USA . 3,012 parts In-Stock

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3,012

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$18.355

100+ parts

-

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520

$18.355

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One Stop Electronics

USA . 789 parts In-Stock

1+ parts

$20.000

100+ parts

-

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789

$20.000

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$22.697

100+ parts

-

1k+ parts

$23.358

10k+ parts

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1,380

$22.697

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$23.358

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DigiPath Technology Company

USA . 299 parts In-Stock

1+ parts

$24.992

100+ parts

$22.993

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-

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299

$24.992

$22.993

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IDEA Electronic Components Group

UK . 2,376 parts In-Stock

1+ parts

$25.502

100+ parts

$24.227

1k+ parts

$22.952

10k+ parts

-

2,376

$25.502

$24.227

$22.952

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ChromeModa Solutions

Germany . 728 parts In-Stock

1+ parts

$25.502

100+ parts

$20.912

1k+ parts

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728

$25.502

$20.912

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Corphita

USA . 4,968 parts In-Stock

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4,968

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Overview

Unleash the power of innovation with the SN55325W by Texas Instruments. Crafted with precision and expertise, this high-quality logic IC offers unmatched reliability and performance. From military-grade applications to industrial automation, this versatile component seamlessly integrates into a wide range of systems. Elevate your projects with the superior value, efficiency, and durability that only Texas Instruments can provide. Trust in the SN55325W to deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties and are highly reliable, making this product suitable for demanding applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly of electronic circuits, reducing production time and costs.

Package Shape: RECTANGULAR

Rectangular shape provides a standard form factor making it easier to integrate into existing circuit designs.

Power Supplies (V): 5,24

Support for multiple power supply voltages offers flexibility in design and compatibility with different system requirements.

No. of Terminals: 16

Having 16 terminals allows for connections to multiple external components or other integrated circuits, enabling complex functionality.

Package Style (Meter): FLATPACK

Flatpack style offers a compact and space-saving package design, ideal for applications where board space is limited.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments or applications where temperature fluctuations occur.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable performance even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal positioning provides redundancy in connections, enhancing reliability and ensuring proper functionality.

Temperature Grade: MILITARY

Military-grade temperature specifications indicate high reliability and performance in rugged or critical applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control, making this product a suitable choice for applications requiring fast signal processing.

Terminal Form: FLAT

Flat terminal form factor facilitates efficient soldering and connection, ensuring reliable electrical contact.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting on PCBs, enabling compact and complex circuit designs.

Technical Specifications

Other Function Logic ICs SN55325W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN55325W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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