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SN74ALS6310AN

Texas Instruments

SN74ALS6310AN by Texas Instruments

SN74ALS6310AN by Texas Instruments is a TTL technology IC with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy, suitable for commercial-grade applications. With an operating temperature range of 0 to 70°C, it is commonly used in various other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,430 parts In-Stock

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2,430

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Vyrian

USA . 2,254 parts In-Stock

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2,254

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Standard Data Resources

USA . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,169 parts In-Stock

1+ parts

$9.000

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1,169

$9.000

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AZTECH Wire

Italy . 796 parts In-Stock

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$10.467

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796

$10.467

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Parana Technologies

USA . 1,857 parts In-Stock

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$19.645

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$19.637

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1,857

$19.645

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$19.637

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DigiPath Technology Company

USA . 1,027 parts In-Stock

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$21.632

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$19.901

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1,027

$21.632

$19.901

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ChromeModa Solutions

Germany . 5,423 parts In-Stock

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$22.073

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$18.100

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$22.073

$18.100

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IDEA Electronic Components Group

UK . 600 parts In-Stock

1+ parts

$22.073

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$20.969

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$19.866

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600

$22.073

$20.969

$19.866

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Corphita

USA . 693 parts In-Stock

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693

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the SN74ALS6310AN Other Function Logic IC. This versatile component offers unparalleled performance in a variety of applications, providing customers with unmatched value and benefits. Trust in Texas Instruments to deliver cutting-edge technology and superior products that meet your needs and exceed your expectations. Elevate your projects with the SN74ALS6310AN and experience the advantages of working with a leading manufacturer in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications while ensuring longevity.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and space-saving integration into electronic circuits or PCBs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a lower supply voltage of 5V reduces power consumption and heat generation, making it energy-efficient.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand moderate heat levels without compromising functionality.

Technology: TTL

TTL (Transistor-Transistor Logic) technology provides high speed and low power consumption, making the product efficient for logic operations.

Technical Specifications

Other Function Logic ICs SN74ALS6310AN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ALS6310AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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