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SN75324NP3

Texas Instruments

SN75324NP3 by Texas Instruments

The Texas Instruments SN75324NP3 is a 14-terminal logic IC with bipolar technology. Operating temperature range of 0-70°C, it has dual terminal position in an in-line package style. Ideal for commercial applications requiring reliable signal processing and control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,318 parts In-Stock

1+ parts

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8,318

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Digiode

USA . 2,356 parts In-Stock

1+ parts

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2,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$6.916

100+ parts

-

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704

$6.916

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Parana Technologies

USA . 2,148 parts In-Stock

1+ parts

$12.670

100+ parts

-

1k+ parts

$13.132

10k+ parts

-

2,148

$12.670

-

$13.132

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DigiPath Technology Company

USA . 483 parts In-Stock

1+ parts

$13.951

100+ parts

$12.835

1k+ parts

-

10k+ parts

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483

$13.951

$12.835

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ChromeModa Solutions

Germany . 3,804 parts In-Stock

1+ parts

$14.236

100+ parts

$11.674

1k+ parts

-

10k+ parts

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3,804

$14.236

$11.674

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IDEA Electronic Components Group

UK . 372 parts In-Stock

1+ parts

$14.236

100+ parts

$13.524

1k+ parts

$12.812

10k+ parts

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372

$14.236

$13.524

$12.812

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One Stop Electronics

USA . 1,429 parts In-Stock

1+ parts

$20.000

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1,429

$20.000

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Corphita

USA . 3,202 parts In-Stock

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3,202

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Overview

Elevate your electronic designs with the SN75324NP3 by Texas Instruments, a top-quality Other Function Logic IC that offers unmatched performance and reliability. Manufactured by Texas Instruments, a trusted name in the industry, this versatile IC is perfect for a wide range of applications. With a durable plastic/epoxy package and dual terminals, this IC ensures seamless integration into your projects. Experience the value and benefits of Texas Instruments' cutting-edge technology with the SN75324NP3, designed to exceed your expectations and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and cost-effective material for IC packages, making this product reliable and affordable.

Package Shape: RECTANGULAR

Rectangular shapes are commonly used for IC packages, providing a compact and easy-to-mount design for various applications.

No. of Terminals: 14

With 14 terminals, this IC can handle multiple input and output connections, making it versatile for different circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style is convenient for mounting on circuit boards and allows for easy integration into electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can perform reliably in various environmental conditions without overheating.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that this IC can function effectively even in colder environments.

Terminal Position: DUAL

Dual terminal positions allow for more flexible wiring options and easy connections, enhancing the usability of this IC.

Temperature Grade: COMMERCIAL

Commercial-grade temperature specifications indicate that this IC is suitable for standard electronic applications in commercial settings.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and high noise immunity, making this IC suitable for applications requiring precise and reliable performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals simplify the assembly process and provide secure connections to the circuit board, ensuring the long-term reliability of this IC.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy soldering and maintenance of connections on the circuit board, making this IC user-friendly for assembly and repair.

Technical Specifications

Other Function Logic ICs SN75324NP3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN75324NP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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