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HMC853LC3

Analog Devices

HMC853LC3 by Analog Devices

Analog Devices' HMC853LC3 is a BICMOS technology IC with 16 terminals, operating from -40 to 85°C. It has a max frequency of 28GHz at -3.3V, suitable for industrial applications requiring positive edge triggering in a compact square chip carrier package.

Median Price

$249.365

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$110.730

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-

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5

$110.730

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Rochester

USA . 108 parts In-Stock

1+ parts

$220.790

100+ parts

$207.540

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$194.300

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108

$220.790

$207.540

$194.300

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Analog Devices Inc

USA . 3,342 parts In-Stock

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$230.720

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$212.270

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3,342

$230.720

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$212.270

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Chip1Stop

Japan . 5 parts In-Stock

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$236.700

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$236.700

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Farnell

UK . 2 parts In-Stock

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$262.030

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$262.030

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Mouser Electronics

USA . 4 parts In-Stock

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$360.520

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$300.090

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$360.520

$300.090

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DigiKey

USA . 2 parts In-Stock

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$360.820

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$300.186

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$360.820

$300.186

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Element14

Singapore . 2 parts In-Stock

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$408.770

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$408.770

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Verical

USA . 3,540 parts In-Stock

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3,540

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Digiode

USA . 422 parts In-Stock

1+ parts

$195.064

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422

$195.064

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Vyrian

USA . 908 parts In-Stock

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$205.330

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908

$205.330

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Distributors (Availability)

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Parana Technologies

USA . 797 parts In-Stock

1+ parts

$26.051

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$24.228

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797

$26.051

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$24.228

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IDEA Electronic Components Group

UK . 2,191 parts In-Stock

1+ parts

$28.012

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$26.611

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2,191

$28.012

$26.611

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DigiPath Technology Company

USA . 971 parts In-Stock

1+ parts

$43.699

100+ parts

$41.951

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$41.951

971

$43.699

$41.951

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$41.951

Ampacity Inc.

Singapore . 737 parts In-Stock

1+ parts

$174.530

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737

$174.530

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Semicontronic

India . 661 parts In-Stock

1+ parts

$176.330

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$171.922

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$171.040

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661

$176.330

$171.922

$171.040

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Corphita

USA . 332 parts In-Stock

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$184.797

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332

$184.797

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Vigor

Singapore . 396 parts In-Stock

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$202.380

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396

$202.380

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Component Stockers USA

USA . 1 parts In-Stock

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$260.280

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1

$260.280

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QUARKTWIN TECHNOLOGY LTD

USA . 27,174 parts In-Stock

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27,174

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Elevate your electronic designs with the HMC853LC3 by Analog Devices, a cutting-edge Other Function Logic ICs that offers unparalleled quality and reliability. With a package body material of ceramic and metal-sealed cofired, this chip carrier boasts a very thin profile and heat sink/slug for optimal performance. Ideal for industrial applications, this innovative IC operates flawlessly in temperatures ranging from -40°C to 85°C. Trust Analog Devices to deliver top-notch technology with the HMC853LC3, providing customers with unmatched value and benefits for their projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides excellent durability and heat dissipation, making the product suitable for industrial applications.

Surface Mount: YES

Facilitates easy and efficient mounting on circuit boards, saving time during assembly.

Power Supplies (V): -3.3

Operates at a low voltage, making it energy efficient and suitable for low-power applications.

Maximum Frequency At Nominal Supply: 28000000000 Hz

Capable of high-frequency operation, allowing for fast and precise signal processing.

Technology: BICMOS

Utilizes BiCMOS technology for a good balance between power efficiency and speed, enhancing overall performance.

Technical Specifications

Other Function Logic ICs HMC853LC3 attributes and parameters. Explore more Other Function Logic ICs devices from Analog Devices

Specs

Family:

853

JESD-30 Code:

S-CQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

28000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-3.3

Qualification:

Not Qualified

Maximum Seated Height:

.92 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

HMC853LC3 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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