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SN74120N

Texas Instruments

SN74120N by Texas Instruments

SN74120N by Texas Instruments is a TTL IC with 2 functions, operating at 5V. It has 16 terminals in an IN-LINE package, suitable for commercial applications. With a temperature range of 0-70°C, it offers reliable performance in various electronic circuits.

Median Price

$8.980

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Freelance Electronics

USA . 12 parts In-Stock

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$8.694

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$9.129

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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Digiode

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A2Z Electronics, Inc.

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Manotoh

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Electronic Expediters

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J & M Industries LLC

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ECAB

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Zilex Electronics Inc.

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Prism Electronics

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Pegasus Components GmbH

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Inland Empire Components Inc.

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Resion

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NAC Semi

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LWI Electronics Inc

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Lantek

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Bristol Electronics

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AZTECH Wire

Italy . 461 parts In-Stock

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Parana Technologies

USA . 736 parts In-Stock

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DigiPath Technology Company

USA . 489 parts In-Stock

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IDEA Electronic Components Group

UK . 2,180 parts In-Stock

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ChromeModa Solutions

Germany . 1,889 parts In-Stock

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One Stop Electronics

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GreenTree Electronics

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Overview

Unlock the power of innovation with the SN74120N by Texas Instruments. Crafted with precision and quality, this cutting-edge logic IC boasts a multitude of applications in various industries. Experience seamless performance and reliability with this product, offering unmatched value and benefits to our customers. Trust in Texas Instruments to provide you with top-notch solutions that elevate your projects to new heights. Elevate your creations with the SN74120N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the IC, making it suitable for various environmental conditions.

No. of Functions: 2

Having 2 functions in a single IC provides versatility and efficiency in circuit design.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage makes it compatible with a wide range of electronic devices, providing flexibility in integration.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the IC to withstand elevated temperatures without performance degradation, ensuring reliability.

Technology: TTL

The TTL technology ensures fast response times and efficient signal processing, making the IC suitable for high-speed applications.

Technical Specifications

Other Function Logic ICs SN74120N attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDIP-T16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74120N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-022-2200, 5962010222200, 5962-99-118-6916, 5962991186916, 5962-99-776-3755, 5962997763755

NIIN

010222200, 991186916, 997763755

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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