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NLV14490PG

Onsemi

NLV14490PG by Onsemi

NLV14490PG by Onsemi is a 6-function logic IC with 4 bits, operating at supply voltages from 3V to 18V. With a propagation delay of 740ns and TRUE output polarity, it's ideal for military-grade applications requiring positive edge triggering. This CMOS technology IC has a temperature range of -55 °C to 125°C, making it suitable for harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,171 parts In-Stock

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Vyrian

USA . 836 parts In-Stock

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SupplyDigital Components

Austria . 8,219 parts In-Stock

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TANS Electronics

Latvia . 7,742 parts In-Stock

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Problanco Electronics

Mexico . 5,383 parts In-Stock

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Kulean Microsystems

USA . 5,319 parts In-Stock

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UHIMA Technologies

Türkiye . 948 parts In-Stock

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Corphita

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Corohmni

South Africa . 51 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the NLV14490PG by Onsemi, a leading manufacturer in the industry. This versatile logic IC offers a wide range of applications, providing customers with efficient solutions for their electronic needs. With a focus on value and performance, this product delivers exceptional benefits such as fast propagation delay and true output polarity. Trust Onsemi to provide you with the best technology and innovation for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements for reliable performance.

No. of Functions: 6

Offers versatility and flexibility in the applications where multiple functions are required.

Screening Level: AEC-Q100

Ensures high reliability and quality standards for automotive applications.

Package Shape: RECTANGULAR

Facilitates easy integration and mounting in various circuit designs.

Nominal Supply Voltage: 5 V

Compatible with standard voltage requirements for many electronic systems.

No. of Bits: 4

Suitable for applications requiring 4-bit processing and data manipulation.

No. of Terminals: 16

Provides sufficient connectivity options for interfacing with other components.

Package Style (Meter): IN-LINE

Space-efficient design for compact circuit layouts.

Propagation Delay: 740 ns

Enables fast signal processing and response times.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even in high-temperature environments.

Trigger Type: POSITIVE EDGE

Allows precise control and timing of signals.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions.

Terminal Finish: Tin (Sn)

Corrosion resistance for extended product lifespan.

Terminal Position: DUAL

Enhanced stability and secure connections.

Maximum Seated Height: 4.44 mm

Suitable for applications with height restrictions.

Width: 7.62 mm

Compact size for space-saving integration.

Output Polarity: TRUE

Provides accurate signal output for reliable data processing.

Minimum Supply Voltage: 3 V

Supports low voltage operation for energy-efficient systems.

Length: 19.175 mm

Adequate length for accommodating multiple terminals and connections.

Temperature Grade: MILITARY

Meets stringent military standards for ruggedness and reliability.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and assembly onto circuit boards.

Terminal Pitch: 2.54 mm

Standard spacing for compatibility with existing PCB designs.

Count Direction: RIGHT

Provides a logical counting direction for data processing.

Maximum Supply Voltage: 18 V

Supports a wide range of voltage inputs for versatile applications.

Technical Specifications

Other Function Logic ICs NLV14490PG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

740 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

NLV14490PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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