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NLV14559BDWR2G

Onsemi

NLV14559BDWR2G by Onsemi

NLV14559BDWR2G by Onsemi is a 16-terminal CMOS logic IC with a supply voltage range of 3-18V. Operating b/w -55 to 125 °C, it's ideal for military-grade applications. With a compact rectangular package style and surface-mount design, it offers versatile integration in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,931 parts In-Stock

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Digiode

USA . 1,264 parts In-Stock

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Vigor

Singapore . 275 parts In-Stock

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$6.600

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275

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AZTECH Wire

Italy . 1,008 parts In-Stock

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$12.820

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Problanco Electronics

Mexico . 6,625 parts In-Stock

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Kulean Microsystems

USA . 6,320 parts In-Stock

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SupplyDigital Components

Austria . 4,407 parts In-Stock

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TANS Electronics

Latvia . 833 parts In-Stock

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Corphita

USA . 763 parts In-Stock

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Corohmni

South Africa . 388 parts In-Stock

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UHIMA Technologies

Türkiye . 345 parts In-Stock

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Overview

Unleash the power of innovation with the NLV14559BDWR2G by Onsemi! Crafted with precision and expertise, this high-quality Other Function Logic IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this product ensures seamless operation and efficiency. Experience the value and benefits of choosing Onsemi - where cutting-edge technology meets top-notch quality. Elevate your projects with the NLV14559BDWR2G and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the logic IC, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on printed circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with a wide range of systems and ensures reliable performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C enables the logic IC to withstand harsh environmental conditions and maintain stable operation.

Technology: CMOS

The CMOS technology used in this logic IC offers low power consumption, high noise immunity, and compatibility with different logic levels, making it a versatile and efficient choice.

Technical Specifications

Other Function Logic ICs NLV14559BDWR2G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NLV14559BDWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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