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SN74TVC3010DGVRG4

Texas Instruments

SN74TVC3010DGVRG4 by Texas Instruments

SN74TVC3010DGVRG4 by Texas Instruments is a MOS technology IC with 24 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 0.6V to 5V and features TRUE output polarity. This small outline IC is ideal for industrial applications requiring high-temperature operation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,033 parts In-Stock

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Digiode

USA . 3,466 parts In-Stock

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3,466

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Distributors (Availability)

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AZTECH Wire

Italy . 641 parts In-Stock

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$13.466

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641

$13.466

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Parana Technologies

USA . 2,291 parts In-Stock

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$29.822

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$63.659

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$63.659

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DigiPath Technology Company

USA . 188 parts In-Stock

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$32.838

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188

$32.838

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ChromeModa Solutions

Germany . 3,700 parts In-Stock

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$33.508

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$27.477

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$33.508

$27.477

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IDEA Electronic Components Group

UK . 287 parts In-Stock

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$33.508

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$31.833

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$30.157

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287

$33.508

$31.833

$30.157

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One Stop Electronics

USA . 1,303 parts In-Stock

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$46.000

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A-Z Elektronik GmbH

Germany . 6,080 parts In-Stock

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Corphita

USA . 4,019 parts In-Stock

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Microchip USA

USA . 2,592 parts In-Stock

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Overview

Unlock the power of innovative technology with the SN74TVC3010DGVRG4 by Texas Instruments. This high-quality Other Function Logic IC offers unmatched performance and reliability, thanks to its cutting-edge design and superior manufacturing by Texas Instruments. Perfect for a wide range of applications, this product provides exceptional value and benefits to customers looking for top-of-the-line solutions. Experience the advantages of this product today and take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability to the product.

Surface Mount: YES

Surface mount design makes it easier to integrate the product into various electronic applications.

Nominal Supply Voltage / Vsup (V): 2.1

Operates at a nominal supply voltage of 2.1V, suitable for low power consumption applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures, making it suitable for industrial environments.

Technology: MOS

Utilizes Metal Oxide Semiconductor technology for fast and efficient logic operations.

Technical Specifications

Other Function Logic ICs SN74TVC3010DGVRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

74

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.1

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

.6 V

Nominal Supply Voltage / Vsup (V):

2.1

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74TVC3010DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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