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THCT2000EN

Texas Instruments

THCT2000EN by Texas Instruments

THCT2000EN by Texas Instruments is an industrial-grade logic IC with 28 terminals in a rectangular plastic/epoxy package. Operating temperature ranges from -40°C to 85°C, making it suitable for various applications requiring reliable performance in harsh environments. Its through-hole terminal form and 2.54mm pitch offer ease of integration into electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,039 parts In-Stock

1+ parts

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5,039

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Digiode

USA . 2,894 parts In-Stock

1+ parts

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2,894

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 785 parts In-Stock

1+ parts

$4.000

100+ parts

-

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785

$4.000

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AZTECH Wire

Italy . 802 parts In-Stock

1+ parts

$17.025

100+ parts

-

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802

$17.025

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Parana Technologies

USA . 1,427 parts In-Stock

1+ parts

$22.034

100+ parts

-

1k+ parts

$22.589

10k+ parts

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1,427

$22.034

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$22.589

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DigiPath Technology Company

USA . 1,162 parts In-Stock

1+ parts

$24.262

100+ parts

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1,162

$24.262

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ChromeModa Solutions

Germany . 3,839 parts In-Stock

1+ parts

$24.757

100+ parts

$20.301

1k+ parts

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3,839

$24.757

$20.301

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IDEA Electronic Components Group

UK . 786 parts In-Stock

1+ parts

$24.757

100+ parts

$23.519

1k+ parts

$22.281

10k+ parts

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786

$24.757

$23.519

$22.281

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Corphita

USA . 1,893 parts In-Stock

1+ parts

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1,893

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Overview

Unlock a world of possibilities with the THCT2000EN by Texas Instruments, a cutting-edge Other Function Logic IC that promises top-tier performance and reliability. Crafted by the trusted manufacturer Texas Instruments, this innovative product boasts a wide range of applications, from industrial automation to consumer electronics. With a sturdy plastic/epoxy body and 28 terminals in a convenient rectangular package shape, the THCT2000EN ensures seamless integration into any project. Experience unmatched quality and precision with this versatile IC, making it an essential component for your next electronics venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the internal components of the IC, making it suitable for various industrial applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit layouts and board designs, optimizing space utilization.

No. of Terminals: 28

Having 28 terminals provides flexibility in connections and increases the range of functionalities that can be implemented with this IC.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function reliably in a broad range of temperature conditions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures consistent operation under harsh conditions without compromising performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, especially in applications where vibration or mechanical stress is a concern.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy soldering and assembly, making this IC convenient for both prototyping and production purposes.

Technical Specifications

Other Function Logic ICs THCT2000EN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

Logic IC Type:

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

THCT2000EN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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