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MC14559BCPG

Onsemi

MC14559BCPG by Onsemi

MC14559BCPG by Onsemi is a CMOS IC with 16 terminals, operating at -55 to 125 °C. It has a supply voltage range of 3-18V and max frequency of 800kHz. Widely used in military applications due to its robust design and reliability.

Median Price

$7.635

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 200 parts In-Stock

1+ parts

$4.910

100+ parts

$4.810

1k+ parts

$4.710

10k+ parts

-

200

$4.910

$4.810

$4.710

-

Arrow

USA . 498 parts In-Stock

1+ parts

$10.360

100+ parts

$4.920

1k+ parts

-

10k+ parts

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498

$10.360

$4.920

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 828 parts In-Stock

1+ parts

$4.664

100+ parts

-

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-

10k+ parts

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828

$4.664

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Vyrian

USA . 8,017 parts In-Stock

1+ parts

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8,017

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 340 parts In-Stock

1+ parts

$4.419

100+ parts

-

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-

10k+ parts

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340

$4.419

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Corohmni

South Africa . 113 parts In-Stock

1+ parts

$4.910

100+ parts

-

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113

$4.910

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-

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Component Stockers USA

USA . 398 parts In-Stock

1+ parts

$9.950

100+ parts

$4.730

1k+ parts

-

10k+ parts

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398

$9.950

$4.730

-

-

AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$16.470

100+ parts

-

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506

$16.470

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-

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Problanco Electronics

Mexico . 7,155 parts In-Stock

1+ parts

-

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7,155

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TANS Electronics

Latvia . 5,088 parts In-Stock

1+ parts

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5,088

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Kulean Microsystems

USA . 4,939 parts In-Stock

1+ parts

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4,939

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SupplyDigital Components

Austria . 2,939 parts In-Stock

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2,939

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UHIMA Technologies

Türkiye . 352 parts In-Stock

1+ parts

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352

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Microchip USA

USA . 312 parts In-Stock

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100+ parts

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312

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Overview

Unleash the power of innovation with the MC14559BCPG by Onsemi! As a leader in the industry, Onsemi delivers top-notch quality and reliability. The MC14559BCPG falls under the category of Other Function Logic ICs, offering versatile applications across various industries. Customers can trust in the value, benefits, and advantages that this product brings to their projects. Experience seamless performance and optimal results with the MC14559BCPG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, ensuring the product is long-lasting and easy to handle.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides stable power to the product, ensuring reliable performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without malfunctioning.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Frequency At Nominal Supply: 800000 Hz

With a high maximum frequency, this product is suitable for high-speed applications that require quick processing.

Technical Specifications

Other Function Logic ICs MC14559BCPG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

SERIAL OUTPUT, ALL CONTROL INPUTS POSITIVE-EDGE TRIGGERED

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

800000 Hz

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14559BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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