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74LVC1G97W6-7

Diodes Incorporated

74LVC1G97W6-7 by Diodes Incorporated

74LVC1G97W6-7 by Diodes Inc. is a CMOS logic IC with Schmitt Trigger feature, operating at -40 to 125 °C. It has a propagation delay of 7.9 ns at Vsup of 3.3V, suitable for automotive applications due to its small form factor and low power consumption.

Median Price

$0.067

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 14,181 parts In-Stock

1+ parts

$0.180

100+ parts

$0.092

1k+ parts

$0.076

10k+ parts

$0.068

14,181

$0.180

$0.092

$0.076

$0.068

Mouser Electronics

USA . 5,970 parts In-Stock

1+ parts

$0.180

100+ parts

$0.093

1k+ parts

$0.076

10k+ parts

$0.071

5,970

$0.180

$0.093

$0.076

$0.071

Verical

USA . 1,041,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.067

1,041,000

-

-

-

$0.067

Avnet

USA . 9,000 parts In-Stock

1+ parts

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9,000

-

-

-

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Arrow

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.041

9,000

-

-

-

$0.041

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.055

3,000

-

-

-

$0.055

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.078

100+ parts

-

1k+ parts

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10k+ parts

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50

$0.078

-

-

-

IBS Electronics

USA . 1,059,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.078

1,059,000

-

-

-

$0.078

NAC Semi

USA . 798,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$0.052

798,000

-

-

-

$0.052

Vyrian

USA . 23,469 parts In-Stock

1+ parts

-

100+ parts

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23,469

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VNN

France . 12,229 parts In-Stock

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12,229

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Chip Stock

USA . 7,500 parts In-Stock

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7,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 23,401 parts In-Stock

1+ parts

$0.030

100+ parts

$0.029

1k+ parts

$0.029

10k+ parts

-

23,401

$0.030

$0.029

$0.029

-

Ampacity Inc.

Singapore . 23,289 parts In-Stock

1+ parts

$0.030

100+ parts

-

1k+ parts

-

10k+ parts

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23,289

$0.030

-

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Corohmni

South Africa . 981 parts In-Stock

1+ parts

$0.078

100+ parts

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981

$0.078

-

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Continental Prestige Electronics

USA . 6,808 parts In-Stock

1+ parts

$0.078

100+ parts

-

1k+ parts

-

10k+ parts

$0.076

6,808

$0.078

-

-

$0.076

Argo Parts USA

USA . 2,430 parts In-Stock

1+ parts

$0.078

100+ parts

-

1k+ parts

-

10k+ parts

$0.076

2,430

$0.078

-

-

$0.076

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.090

100+ parts

$0.083

1k+ parts

$0.078

10k+ parts

-

100

$0.090

$0.083

$0.078

-

Aztec Data Supply Inc.

USA . 229 parts In-Stock

1+ parts

$20.550

100+ parts

-

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229

$20.550

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Lixinc

USA . 15,624 parts In-Stock

1+ parts

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15,624

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Perfect Parts

USA . 14,448 parts In-Stock

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14,448

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

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6,000

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Speed Components Ltd (Excess)

Israel . 42 parts In-Stock

1+ parts

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42

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Overview

Looking for top-quality Other Function Logic ICs? Look no further than the 74LVC1G97W6-7 by Diodes Incorporated. Known for their innovative technology and reliable products, Diodes Incorporated delivers exceptional performance and durability in all their offerings. This versatile IC is perfect for a wide range of applications, providing fast propagation delay at a nominal supply voltage of 3.3V. With a small outline, low profile package and Schmitt Trigger technology, this product is ideal for automotive use and more. Experience the value and benefits of the 74LVC1G97W6-7 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance over time.

Propagation Delay At Nominal Supply: 7.9 ns

Fast propagation delay allows for quick signal processing, making this IC suitable for high-speed applications.

Surface Mount: YES

Surface-mount capability enables easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, making it compatible with a wide range of systems and devices.

Load Capacitance (CL): 50 pF

Optimized for a specific load capacitance, ensuring stable and efficient performance in various circuit configurations.

Power Supplies (V): 3.3

Consistent power supply voltage ensures reliable operation and compatibility with other components in the system.

No. of Terminals: 6

Provides sufficient connections for interfacing with other components and peripherals, enabling versatile functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact and low-profile design saves space on the PCB and facilitates efficient routing of signal traces.

Maximum I (ol): 24 Amp

High output current capability allows the IC to drive demanding loads or multiple devices without compromising performance.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable operation in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand low-temperature conditions, making it suitable for a variety of applications in different environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring a secure and long-lasting connection.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and orientation, accommodating various PCB layouts and designs.

Maximum Seated Height: 1.35 mm

Low profile design enables space-saving installation in compact electronic devices and systems.

Width: 1.6 mm

Compact width dimension allows for efficient PCB layout and integration into tight spaces.

Minimum Supply Voltage (Vsup): 1.65 V

Supports operation at low supply voltages, enhancing energy efficiency and compatibility with power-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables soldering in lead-free processes and ensures robust mechanical connections.

Length: 2.85 mm

Compact length dimension facilitates space-efficient placement on the PCB and allows for versatile system design.

Temperature Grade: AUTOMOTIVE

Designed and tested for automotive applications, ensuring reliable performance in challenging operating conditions.

Schmitt Trigger: YES

Incorporates Schmitt trigger functionality for signal conditioning and noise immunity, enhancing signal integrity and reliability.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form enables reliable solder joints and facilitates automated assembly processes, ensuring consistent quality.

Packing Method: TR

Tape and reel packaging method simplifies handling, storage, and automated assembly of multiple components in manufacturing environments.

Terminal Pitch: 0.95 mm

Optimal terminal pitch allows for precise placement on the PCB and supports high-density mounting for efficient use of board space.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range provides flexibility in system design and operation, accommodating a variety of voltage levels.

Technical Specifications

Other Function Logic ICs 74LVC1G97W6-7 attributes and parameters. Explore more Other Function Logic ICs devices from Diodes Incorporated

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2.85 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.35 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

74LVC1G97W6-7 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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