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SN74ALVTH16260DGGR

Texas Instruments

SN74ALVTH16260DGGR by Texas Instruments

SN74ALVTH16260DGGR by Texas Instruments is a BICMOS technology logic IC with 56 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial applications. With power supplies of 2.5/3.3V, it is ideal for surface mount designs requiring high-speed signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,716 parts In-Stock

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5,716

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Digiode

USA . 505 parts In-Stock

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505

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Distributors (Availability)

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$8.398

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664

$8.398

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Parana Technologies

USA . 202 parts In-Stock

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$24.773

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$25.447

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202

$24.773

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$25.447

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DigiPath Technology Company

USA . 603 parts In-Stock

1+ parts

$27.278

100+ parts

$25.096

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603

$27.278

$25.096

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ChromeModa Solutions

Germany . 5,887 parts In-Stock

1+ parts

$27.835

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$22.825

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5,887

$27.835

$22.825

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IDEA Electronic Components Group

UK . 1,542 parts In-Stock

1+ parts

$27.835

100+ parts

$26.443

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$25.052

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1,542

$27.835

$26.443

$25.052

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One Stop Electronics

USA . 701 parts In-Stock

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$53.000

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701

$53.000

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Corphita

USA . 1,149 parts In-Stock

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1,149

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Overview

Unlock the power of cutting-edge technology with the SN74ALVTH16260DGGR by Texas Instruments. This high-quality logic IC offers unparalleled performance and reliability, making it a top choice for a wide range of applications. From industrial automation to consumer electronics, this versatile component delivers exceptional value and efficiency. Trust in Texas Instruments' reputation for innovation and precision, and elevate your projects to new heights with the SN74ALVTH16260DGGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Power Supplies (V): 2.5/3.3

Compatible with common power supply voltages, making it versatile in different applications.

No. of Terminals: 56

Provides ample connectivity options for various input and output signals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size and thin profile make it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, offering versatility in different operating conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connection options.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with temperature extremes.

Technology: BICMOS

Utilizes BICMOS technology for high performance and power efficiency.

Terminal Form: GULL WING

Gull wing terminals ensure secure connections and ease of soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density mounting and compact design.

Technical Specifications

Other Function Logic ICs SN74ALVTH16260DGGR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALVTH16260DGGR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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